Electronics Forum: air gap (Page 1 of 4)

Thermally Conductive Epoxy

Electronics Forum | Fri Aug 03 22:36:28 EDT 2001 | mugen

We used Thermal Pads, made of black rubbery material, and sticky on both sides (like x2 side tape), intent is to place in between, BGA/QFP and the PCB board, and reduce the air-gap flow between, the PCB to SMD... air-gap will permit air flow, that i

Supported holes, Solder, Vertical Fills, Hidden under connector body

Electronics Forum | Thu Oct 18 10:40:27 EDT 2018 | emeto

David, you can beat around the bush interpreting criteria, but without X-ray you will not see anything. This is the way to go to inspect this solder joints properly. Criteria is 75% fillet and than you have circumference, air gaps in there....

Profiling LQFP-144 with ground plane

Electronics Forum | Thu Feb 24 15:36:34 EST 2022 | dontfeedphils

Looks like a decent profile. Only recommendation I have would be to possibly try and high-temp solder the thermocouples rather than the aluminum tape/kapton, only because you can get air-gaps and inaccurate readings using the tape method on assemble

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 03:43:00 EDT 2018 | cmchoue

Dear Experts, Have any paper or data talking about the design guideline for avoiding BGA solder bridge? I desire to know the rule(guideline)that compare difference stencil thickness and safe solder design distance (air gap) can avoid bridge.

DEK print problem?

Electronics Forum | Wed Mar 26 09:26:12 EDT 2008 | lloyd

I know you said you checked your clamps but another look will do no harm. we had a very similar issue a while back, and it turned out that the plastic shim under the chase clamp magnet was damaged. This caused the chase clamps not to release properly

raised component measurement

Electronics Forum | Fri Sep 18 12:21:03 EDT 2009 | kennyg

Does anyone have any off-the-shelf tool for measuring air gaps under components? Specifically to measure if a part is raised beyond special specifications, such as determining if a leaded connector is raised beyond 5, 10 or 20 mils from the PCB surf

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue

Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Fri Sep 07 04:19:59 EDT 2018 | spoiltforchoice

You have lost me, its a stencil, you can change the aperture size, you can change the thickness and you can change the walls of the aperture. And all of those things will be in the papers anyone can find with a google. I have no clue what safe air g

Temperature Profiling

Electronics Forum | Thu Dec 10 16:57:32 EST 2009 | vetteboy86

I'm just getting into temperature profiling our PCB's. We recently bought a new reflow oven. The company purchased a mole before I was hired. This is what I will be using. What is the preferred way to attach the thermocouples to the PCB locations of

Temperature Profiling

Electronics Forum | Wed Dec 23 09:11:56 EST 2009 | lynn_norman

In a former life, we used hi temp solder. I've heard of adhesive and taping methods, we just never used them. We too had a "golden" assembly that we would use for routine profiling. Our requirement was to attach a TC to the lowest thermal mass, hi

  1 2 3 4 Next

air gap searches for Companies, Equipment, Machines, Suppliers & Information

Global manufacturing solutions provider

Component Placement 101 Training Course
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

World's Best Reflow Oven Customizable for Unique Applications