Electronics Forum | Fri Nov 17 14:42:06 EST 2006 | billwestiet
Mark, This is a big topic. Where are you located, it would probably be best to hook you up with someone in your area. Anyhow, lead or lead free should be based on whether the circuits are lead or lead free. I would guess that cell phones would all
Electronics Forum | Thu Nov 16 23:34:56 EST 2006 | mds33200
Hi, I am new in this industry and have purchased a beguinner unut, a 3-in-1 solder, desolder, hot air station. Currently I work on cellphone mainboards. At the moment I only replace single large chips on the mainboard. I would like to be able to repl
Electronics Forum | Thu Mar 17 22:47:29 EST 2005 | davef
That would be our first guess, also. Get the stuff analyzed to be sure. Another clue is if the white stuff disappears when you hit it with hot air from a rework station. The hot air is activate the flux. Good troubleshooting tool, but you're subj
Electronics Forum | Wed Sep 07 17:04:28 EDT 2005 | bhu
Anyone have any recommendations for hot air, hand held rework stations? We currently use Hakko for leaded assembly. We already have a sniper for bga rework.
Electronics Forum | Thu May 13 12:41:10 EDT 1999 | Eric
| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | I have been doing
Electronics Forum | Wed May 19 10:48:40 EDT 1999 | Glenn Robertson
| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | I ha
Electronics Forum | Tue May 11 12:02:03 EDT 1999 | Tony
| We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | All other tips are also welcome. | | Thanks | Philip, I have been doing BGA rework for
Electronics Forum | Thu Mar 29 07:37:45 EDT 2012 | davef
The current discussion about solder fountains has to do with copper dissolution. Broadly, copper dissolution is the weakening of copper traces where a trace and a barrel plating intersect due a loss of the copper into the solder. Longer contact time
Electronics Forum | Mon Jan 21 19:10:29 EST 2008 | hegemon
The APE machines are still OK in their place. We still have two APE machines that are over 8 years old and still are good for some processes, but have been consigned to the leaded solder rework area. We have upgraded to AirVac since the advent of le
Electronics Forum | Tue Jan 03 11:01:19 EST 2012 | julie331975
We are working with .065" thick metal core PCB's. I have a couple boards that are in need of rework. The components we are placing are similar to a SOJ package with a solder pad underneath the component. We are also using a lead free process. I have
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