Electronics Forum | Wed May 29 08:43:12 EDT 2002 | zanolli
Various solder metal supplies sell pre-forms as loose individual shapes, usually donuts. The loose performs then are placed on the connector leads. If you have any volume at all, you would want to look at a �shake table� that would vibrate a batch of
Electronics Forum | Tue Jun 04 20:34:28 EDT 2002 | russ
Jason, Excessive thermal ramp rates, misprints, improper pad design, paste type, placement pressure, all can cause solderballs. Do the pads on this board meet IPC 782 criterias? I have found that too much pad underneath component can cause this. A
Electronics Forum | Tue Jun 04 12:54:00 EDT 2002 | Bob
Hi, We are manufacturing a small PCB with large areas of gold plating. We experience from time to time what appear to be solder splashes on the gold areas. I do not believe the contamination to be from "outgassing" due to the distance from the dep
Electronics Forum | Wed Jun 19 00:07:10 EDT 2002 | kenbliss
arzucom, have you considered using trays to handle your boards in process and your handbuilds. This method is fast becoming the industry standard method for a large variety of reasons, specifically ESD as when the boards are in the tray your people
Electronics Forum | Wed Jun 19 00:07:31 EDT 2002 | kenbliss
arzucom, have you considered using trays to handle your boards in process and your handbuilds. This method is fast becoming the industry standard method for a large variety of reasons, specifically ESD as when the boards are in the tray your people
Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick
Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a
Electronics Forum | Thu Jun 06 21:35:22 EDT 2002 | ianchan
Hi mates, 1) Firstly, thanks for everyone's reply to this thread. Cheers! 2) Secondly, Hussman69: sure u dun mean that blokes' tie was too tight? musta cut off his blood flow and oxygen?!? 3) Thirdly, we checked with our paste supplier, and they r
Electronics Forum | Thu Jun 06 07:53:51 EDT 2002 | Jim M.
Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required? Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order
Electronics Forum | Wed Jun 19 14:44:11 EDT 2002 | kenbliss
It sounds like your inspector improved quality and pre-staging your feeders dramaticaly increased uptime on your machine, thats great to hear. One cautiionary note, be careful not to flood your production area with parts off of your SMT line. With
Electronics Forum | Wed Jun 12 08:24:03 EDT 2002 | davef
Tough. 0402 capacitors are more prone to tomb stoning than resistors. Tailor your process to the 0402 and let the other stuff fall where it falls. Search the fine SMTnet archives for discussion on tomb stoning. Consider: * Changing paste. * Apply
