Electronics Forum | Wed Aug 16 17:42:02 EDT 2000 | John Thorup
Hi Steve You really didn't tell us what is going wrong. Not enough heat to melt this hi temp solder (290C/554F)? Too much heat and burning up the pad/board? Thermo falling off? (remove all the original solder) You won't find Loctite 384 all that remo
Electronics Forum | Sat Aug 05 12:12:05 EDT 2000 | Ramon I Garcia C
Hello Friends: I'm new in SMT process, I have a problem with little balls of solder beside of the component, I'm tried reducing the apertures in the stencil and making home base, some times the balls desappear, but some time not, and some times
Electronics Forum | Fri Jul 28 21:07:13 EDT 2000 | Wilson
Dear all, Thanks for your comment! Dave, your suggestion is very useful. I can find several good machines at there. Thanks! John, your curiosity is quite normal, as I also have no idea of the board. It is a new model. We haven't got the boards yet,
Electronics Forum | Thu Jul 20 14:07:23 EDT 2000 | JohnW
Mike, we use carrier's as a matter of course on all wave products, it let's us keep the conveyor width the same all the time so speed's up change overs and eleimiates one more thing that can be set wrong. The main aim of the exercise is to be able
Electronics Forum | Tue Jul 11 11:59:34 EDT 2000 | George English
Looking for some welcome advise again folks. We are currently using a reflow profiling software package which requires passing a data logging unit through the oven attached via thermocouples to a populated 'dummy' PCB. The problem is we have a very
Electronics Forum | Thu Jun 29 10:11:06 EDT 2000 | John Thorup
Hi Bob, welcome Let's take this a little further. You'll also see HASL referred to as HAL and gold referred to as ENIG (electroless nickle, immersion gold. Other common surface finishes for preserving solderability include OSP(organic suface protect
Electronics Forum | Mon Jul 10 12:39:07 EDT 2000 | Chris C
Hi Christopher, To my knowledge, heat seal along will not provide you the desire condition. Currently, we're using vacuum sealer to reseal all MSD restock items. If you have variety of package and constantly need to reseal the MSD parts, I'd like to
Electronics Forum | Wed Jun 14 12:43:52 EDT 2000 | Todd Murphy
Dave, you are right you would expect the soldermask to be higher than all SMT pads on the pcb if it is higher on the fine pitch components, but the other areas of the board do not concern me as much as the fine pitch areas. The pads on all the other
Electronics Forum | Tue Apr 03 00:55:34 EDT 2001 | philipreyes
Hello Billy!! IPC 7095 covers all the design rules and guide lines in BGA assembly and inspection, this will help you a lot in your problem...But based on your problem, it seems that all the balls were disappeared, try to check the capability of
Electronics Forum | Tue May 09 17:17:17 EDT 2000 | Earl Moon
Armin, Wolfey, Dave, Jeff, and some others I remember well who have moved on too (way too many to count but all left unfufilled here), I am back. No, just kidding. I still look in from time to time. All of you on the forum are great. I simply decide
