Electronics Forum | Tue Nov 21 12:04:52 EST 2006 | Rob
From what I remember it was kind of obsolete before it started as the CP6 came along shortly afterwards & we all know how great they still are. It didn't offer much more than the CP4's so it was kind of squeezed out. I do remember hearing of one
Electronics Forum | Fri Nov 24 11:01:13 EST 2006 | joseluis_amper
Hello. I don't know if is neccesary to dry all pcbs before gegin the proccess, or depend of the type of pcbs. It's neccessary to bake the pcbs and components?, only components?.... What proccess do you recomend?. I read that is convenient bake the pc
Electronics Forum | Thu Nov 30 16:31:40 EST 2006 | techgonecrazy
This has been a problem from the start. I used a digital flowmeter to check exhaust and both sides are pretty even, however, I do not know if its exhausting too much or not enough, just going on the PE specs...but then again...do they really know. I
Electronics Forum | Fri Dec 22 09:19:11 EST 2006 | simonlee
Our VIP98 oven just refused to do anything this morning, no previous history of problems. Conveyor and heaters do not start up. None of the Solid State Relays in the back of the unit are operating, although we can make them switch by wiring up to t
Electronics Forum | Fri Dec 22 15:29:30 EST 2006 | mika
The same to You and everybody body else in this forum. I agree with You and looking forward to new challenges next near. I can not emphasize enough how much that this forum have been a lot of help to us. Sometime it has even been funny and we all n
Electronics Forum | Mon Jan 08 13:27:15 EST 2007 | pgarsoe
Is having a specific COB forum a virtue or necessity? Is carving up this forum into various segments going to delute it in any way? We could start any forum segment that the community desires if interest is shown and would not delute this production
Electronics Forum | Tue Jan 30 20:47:32 EST 2007 | davef
Inspection criteria [B Willis] Solder-paste application * Fine-pitch printing Satisfactory solder-paste should: ** Be aligned with all pads ** Conform to the stencil's pad-aperture size ** Have a smooth, flat void-free surface Acceptable solder paste
Electronics Forum | Tue Feb 20 06:05:10 EST 2007 | mk
Thanks to all for the info. The ideas to correct the situation are all excellent and if we see any more boards from this source with this condition we will know what to do now. In the end however, the real questions we are trying to answer are, 1.I
Electronics Forum | Mon Feb 12 10:03:34 EST 2007 | slthomas
"(If any element�s composition is greater then is it useful/harmful to our solder paste/assembling or not?) It certainly changes the characterstics of the compound. Why you might change it depends on how you want it to behave. Be more or less ductil
Electronics Forum | Tue Feb 27 23:58:49 EST 2007 | KEN
Hmmm.... I had Intel survey my process on a mixed alloy line for 2 days. They periodically removed boards from all stations on the line (including post reflow). Boards were "crushed" and spearated into constituent plastic, ceramic and metals. All
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