Electronics Forum: all (Page 426 of 1499)

Going, going, gone, but back

Electronics Forum | Mon Jun 15 19:51:48 EDT 1998 | Earl Moon

I'm off (as you all know) to other pastures. You know - sheep tupping on the green (or some other Elizabethan BS). Anyway, I now have to go to work for a living, or retire (don't remember which), to make a living. Deeply invloved in micro BGA, CBGA,

Re: Going, going, gone, but back

Electronics Forum | Tue Jun 16 14:10:11 EDT 1998 | Wayne

| I'm off (as you all know) to other pastures. You know - sheep tupping on the green (or some other Elizabethan BS). Anyway, I now have to go to work for a living, or retire (don't remember which), to make a living. | Deeply invloved in micro BGA, C

Re: Going, going, gone, but back

Electronics Forum | Tue Jun 16 09:03:57 EDT 1998 | Justin Medernach

| I'm off (as you all know) to other pastures. You know - sheep tupping on the green (or some other Elizabethan BS). Anyway, I now have to go to work for a living, or retire (don't remember which), to make a living. | Deeply invloved in micro BGA, C

Which Paste

Electronics Forum | Fri Jun 05 06:20:19 EDT 1998 | Terry Keen

I am currently reading as many articals as I can to familiaize myself with Surface Mount Technology. My company is planning to install a SM production line by the end of the year. Here is one of my questions. I have read that one of the specification

Re: BGA Pad Dressing After Removal Method / Where's The Beef?

Electronics Forum | Tue Jun 09 09:28:57 EDT 1998 | Earl Moon

| | If any one needs a procedure for rework and repair of BGA there is a document on my Web Site to download www.bobwillis.co.uk | | | What methods do people use to dress pads after removing and before replacing the BGA? | | | We use solder wick and

Re: Providing Thermal Relief On Vias

Electronics Forum | Thu Jun 04 12:22:12 EDT 1998 | John Allan

| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo

Re: Solder Joint Strength

Electronics Forum | Tue May 26 13:01:40 EDT 1998 | Earl Moon

| Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint st

Re: Paladium Leads Revisted

Electronics Forum | Sun May 24 08:24:29 EDT 1998 | Dave F

| | My question is: How does one recognize paladium leads so that the profile can be set properly? | | Dave F | Hi Dave, | It's kinda' subjective, but what I think it looks like is almost like having a nickel appearance to it, it's smoother and

Re: Environmental Issues

Electronics Forum | Thu May 21 20:18:10 EDT 1998 | Earl Moon

| Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently t

Re: SMT training classes and start up equipment

Electronics Forum | Tue Jun 23 11:23:25 EDT 1998 | Russ Miculich

You have addressed two separate issues. We are stencil printer manufacturers and equipment choices can be a real tricky and frustrating proposition if not prepared with training and understanding of the process first. I would heartily encourage you


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