Electronics Forum | Sat Nov 10 23:46:36 EST 2007 | mika
BTW, The surrounded QFN fine pitch terminals should have the normal aperture reduction of 7 % in case of RoHS Senju solder paste. This works for our Telecom customer. The vias in the ground pad will be somewhat filled with solder and makes it diffi
Electronics Forum | Mon Nov 19 16:10:50 EST 2007 | slthomas
Whatever you decide to do, make sure the machine you get meets your requirements for capability as well as cost. We've now got three machines referenced, all with vastly different capabilities, some of which you may have to sacrifice to get the oth
Electronics Forum | Tue Nov 13 02:47:47 EST 2007 | d0min0
from supplier of pcb I get .ger files, but in Dek OLE I need .gbx files to have a pcb picture as a help - Is it possible to covert one to another to use it properly in OLE??? (with CAD or CircuitCam or other???) or maybe I need .gbx files directly? I
Electronics Forum | Thu Nov 15 03:13:08 EST 2007 | duyhoang
Dear all, I want to use fuji flexa software to connect to FIP2 (ROM version 1.82). Does anyone help me to connect it? Do I have to upgrade version of FIP2? Which steps do I have to do to use flexa for FIP2? If it needs to upgrade a higher ROm versio
Electronics Forum | Tue Nov 27 20:48:31 EST 2007 | davef
Shy: You say, "I've already done some evaluation to reduce the heigh of the glue but it fails at wave solder which cause the component to be drop/missing." Based on your evaluation, questions are: * What is the relation between component standoff an
Electronics Forum | Fri Nov 30 08:35:51 EST 2007 | stepheniii
We put glue on the bottom of the board that already has the topside SMT mounted. We populate the board. We put it through a cure profile. At this stage the topside components are soldered on. The bottom side components are glued on with NO solder on
Electronics Forum | Wed Dec 05 10:58:59 EST 2007 | shrek
Mr. Long, me lad, I don't follow. You say stuff about RoHS and all the banned materials covered by RoHS, but what is your theory on how banned substances can get on a RoHS board if you are running both Pb and Pb-free on the same oven?
Electronics Forum | Fri Nov 30 06:16:25 EST 2007 | aj
Hi all, What do most of you aim for when profiling BGAs ? Currently I aim for time above 60 or 70 secs but I read a report that 40 secs would be more suitable. Also peak temp - I aim for 240-245 but again this report stated 230-235. any input app
Electronics Forum | Mon Dec 03 11:49:53 EST 2007 | davef
Paul: We all live in Dilbert-world. Some people think Scott Adams is kidding, but we know he's not. Give yourself a break and just use replacement pads used in repairing damaged BGA circuitry. For instance: http://www.circuitmedic.com/products/CS015
Electronics Forum | Wed Dec 19 18:48:31 EST 2007 | darby
The other thing you could do is fit the cameras with a catseye lens. With my way all the data says the same apart from the fid diameter/shape and logic off/on. Just as accurate as any other method, a lot cheaper - cost = 1 drill, less nerve racking