Electronics Forum: alloys (Page 111 of 122)

Making a BGA stand up

Electronics Forum | Thu Jan 16 03:43:42 EST 2003 | johnw

1st off for the forum folk, I don't like the fact that the new system only let's you see the posting your replying too, I'd rather be able to see the thread..... Anyhoo, why this alloy?, it's because it's the device manufacturers preferred and the c

Wave soldering profiling

Electronics Forum | Wed Apr 14 20:48:43 EDT 2004 | Ken

Just a thought.... Some Fluxes require temperatures upto 260F (127C). Are you using water based flux or solvent (alcohol). I have noticed that many wave machines are NOT capable of preheating adequately when using water based materials. This can

reballing

Electronics Forum | Tue Jan 13 16:01:06 EST 2004 | russ

I believe that solder paste will need to be applied to this part. I have re-balled these in the past in a low volume situation and here is what I did and there appears to be no adverse effects to the component. Get a stencil (I use 8 mil for .032"

BGA ball and PCB pad

Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay

First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183

BGA ball and PCB pad

Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan

Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor

QFP rework

Electronics Forum | Thu Apr 01 13:16:56 EST 2004 | Jimmy

>When these boards are built new do we not have solder >>paste on the ground pad and then reflow? Has this caused >>any misregistration for you? We didnt assemble these boards so I have no knowledge of the manufacturing process that was implemented h

flux on PCB's after cleaning

Electronics Forum | Wed Jul 21 17:49:52 EDT 2004 | jsk

problem: Too many solvents and boards are not clean Flux remains on the board after vapor degreaser and "Powdery" white residue after vapor degreasing Flux type is kester 186 Process: hand solder High Temp alloy, spot clean after hand solder e

Wave solder: Vitronics-Soltec vs. Electrovert

Electronics Forum | Thu Jan 05 16:39:47 EST 2006 | pjc

Electrovert has a new nozzle design called UltraFill. It was designed specifically for Pb Free applications and generates about 40% less dross than the previous Lambda design. UltraFill can of course be used for Sn/Pb alloys. The name UltraFill is fo

BGA Pull test

Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef

First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e

Lead free profile

Electronics Forum | Thu Jan 27 16:43:15 EST 2005 | russ

Ther is a solder alloy out there that is supposed to allow lead free wave processing without having to upgrade pumps and such or increasing the pot temp (direct drop in). I have not used it nor do I plan on doing leadfree wave soldering but you may


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