Electronics Forum: alpha/ (Page 51 of 61)

Re: high temperature solder alloy

Electronics Forum | Fri Oct 08 08:26:03 EDT 1999 | Carol Zhang

| | | I have a board, 4 spacers needed to be soldered on the board | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, ther

More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 08:41:42 EDT 1999 | Dave F

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

Re: MicroBGA printing problem

Electronics Forum | Wed Sep 22 21:23:03 EDT 1999 | se

| | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | The stencil is 6 mil thick, laser cut and electo-polished. | | The apertures are 12 mil in diameter with 20 mil pitch. | | We

Re: MicroBGA printing problem

Electronics Forum | Thu Sep 23 12:47:48 EDT 1999 | Earl Moon

| | | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | | The stencil is 6 mil thick, laser cut and electo-polished. | | | The apertures are 12 mil in diameter with 20 mil pitch.

Re: Proflow of DEK screen printer

Electronics Forum | Tue Sep 07 12:02:30 EDT 1999 | Brad Kendall

| Dear sirs, | | If you have experienced Proflow of DEK screen printer, please let me know the details of it. | | Best regards, | | Jame Bond | | I have had Proflow for about 8 weeks now. I have had my fair share of problems with it. It does

Re: VOC free flux wave solder fixtures

Electronics Forum | Tue Jul 06 14:23:27 EDT 1999 | Earl Moon

| | | I've heard that use of VOC free flux with wavesolder fixtures can be challenging due to entrapment of water in the fixture. | | | | | | Is anyone out there successfully running VOC free with wave fixtures & did you experience problems? If so,

Re: problem in micro-BGA assembly

Electronics Forum | Thu Jun 24 18:24:13 EDT 1999 | Christian N.

| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin

Wave Solder Profiling Basics

Electronics Forum | Fri Jun 25 09:51:35 EDT 1999 | C.K.

| Dear John/Earl | | Thanks for your clarifications. To me also the problem does not seem to be linked with the PCB. The Pre heater temp. is set at | 450 degree C. We are using Alpha Aq. cleanable flux. Can you elaborate on the Desired profilin

Re: Bare Copper Circuit Boards

Electronics Forum | Sun Jun 20 16:58:31 EDT 1999 | Chrys Shea

| Has there anyone bold enough to try this in their shops? My cubemate just got through telling me that at his last shop, they had bare copper boards (no HASL, no OSP, no nothing), with minimal solderability problems. | Is your cubemate the same gu


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