Electronics Forum: alpha and solder and paste (Page 1 of 30)

Evalution on solder paste and spray flux

Electronics Forum | Wed Jan 26 20:52:06 EST 2005 | Chua

Hi, I'm going to evalute new solder paste and flux for wave-solder. Appreciate you could advise what are the things need to look out during the evalution. Any recommend step or proper way of doing solder paste and flux evalution. Appreciate your he

solder paste ingredients and their effects

Electronics Forum | Fri Feb 09 02:30:50 EST 2007 | Muhammad Haris

What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects? AND What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(

Evalution on solder paste and spray flux

Electronics Forum | Thu Jan 27 11:23:45 EST 2005 | russ

Well first off I wouldn't evaluate paste for a wave process. I would use solder bar instead. Flux - top side fillets and no shorting on the solder side, does it clean well after processing if using water soluble flux. How wide is the process win

solder paste ingredients and their effects

Electronics Forum | Fri Feb 09 12:31:35 EST 2007 | realchunks

Ask Brain Toleno at "circuitsassembly.com/blog" He's a smart guy and works as team lead at Henkel Loctite. Just don't take him out for drinks.

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

SOT23s and paste + glue

Electronics Forum | Mon Dec 22 11:09:21 EST 2008 | mfcat

We changed paste manufacturers rather recently and are now seeing SOT23s falling off after wave solder. These parts have a dual process... we stencil print paste, apply glue, populate then reflow. Only SOT23s fall off, chips are fine. We do not be

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Thu Nov 15 09:29:29 EST 2012 | anvil1021

Maybe this piece of information will help. In China (just returned from visit) there are many factories that are using a dual temperature process using SAC305 or Sn100C and 42/58. Apparently this allows them to run their through hole parts through re

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Tue Nov 06 22:37:35 EST 2012 | davef

Ryan ... "As for bismuth-based lead-free alloys, a lower melting temperature than that of tin-lead is offered together with a cost similar to that of tin [in the area of $3/lb]. Unfortunately, bismuth in soldering alloys tends to create embrittlemen

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Fri Nov 02 14:46:18 EDT 2012 | ericrr

So how does this (lead free paste Sn42/Bi58) solder compare with the Sn-Ag-Cu (Tin-Silver-Copper) combination which does not flow as well (in the oven), needs higher oven temperature, (that can be adjusted by reducing the oven chain speed) and cost m

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