Electronics Forum | Mon Dec 11 12:46:02 EST 2000 | Christopher Lampron
We too had a problem with the WS609. We have since switched to Alpha's WS619 (same formula with an anti-foaming agent) This really helped but we still monitor flux application and try to minimize wherever possible. Chris
Electronics Forum | Tue Jun 11 14:58:45 EDT 2002 | Chris Lampron
Hello Sean, We are currently using a Pin in Paste process to mount some through hole relays. This particular board has 72 relays per. We have cut the stencil to overprint the hole. By putting a small amount of solder in the hole to flux the lead, th
Electronics Forum | Thu Jan 17 17:54:22 EST 2008 | dman97
Stay far away from the WS619 paste. It is a nightmare to get a decent solder joint out of it. And dont get me started on voiding issues with this paste. We eventually started to use Indium 3.2 lead free "water wash" paste and this drastically reduced
Electronics Forum | Tue Jan 15 11:50:17 EST 2008 | pbarton
We too are trialling WS819 with SAC305 alloy. The foaming in cleaning causes us a headache but all other attributes seem much improved over earlier types. Previously we were using WS619 - no foaming issues but MUCH shorter stencil life (less than 4 h
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