Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt
Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.
Electronics Forum | Fri Jul 16 11:13:46 EDT 2004 | Inspection Solution
Hi John, If you have any questions on any of the CyberOptics equipment, please feel free to contact http://www.lvtechnologies.com. There is no charge for helping answer any questions. Full service, sales (parts and equipment) and support is also a
Electronics Forum | Fri Jan 20 04:15:36 EST 2006 | Pana/Fui User
6 month back in China -Panasonic CM402 and Dt401 beat NXT flat in terms of quantity and quality so so. Panasonic used RF CVT system for component verification and E plant view to monitor the production output.They were also able to plot charts and g
Electronics Forum | Sat Jan 21 20:20:38 EST 2006 | Curt Couch
Sir, reverse wound springs do help this situation. I would also recommend using acetone in the wind mills, its made of 440C SS and has R/c hardness of 58-60 you need to use something that will cut the gauling deposits left from the aluminum in the no
Electronics Forum | Tue Apr 19 05:42:13 EDT 2005 | woodglass
There's two sensors at the rear of the XY table. Make sure that these are functioning correctly. You can view their states in the I/O map. The solenoid which actuates the table base up/down air cylinder is also at the rear of the table, to the left o
Electronics Forum | Wed Jan 25 01:48:47 EST 2006 | ____
There is a manual available that deals with how to create part data files for connectors and BGA's. Contact Fuji America for this manual. REF-SMD3PD-1.1E. There may be a newer version available than the one I have listed. It is also available in PDF
Electronics Forum | Tue Mar 31 12:43:52 EDT 2009 | dallascap
I don't think there is anything releated to IR light in your false calls rate rise on Post-reflow. Soldering Flux is most probably the reason. Indeed, more or less soldering flux residue condenses on the boards according to the oven extraction syst
Electronics Forum | Wed Mar 10 18:42:34 EST 2010 | 89jeong
Hello Sir. We also encountered the same pin-hole issue but there was around MLCC.I also looked for some information in technical report and internet, But i failed to get an answer. As you know this pin hole or blow hole is caused by the solder boilin
Electronics Forum | Tue Sep 14 14:22:11 EDT 2010 | grahamcooper22
If the HASL was poor quality and very thin you would find this defect....but you would expect to see it on more pads also. Also, you'd expect to see your solder from your solder paste either dewetted on the pad or reflowed onto the BGA sphere making
Electronics Forum | Tue Apr 29 07:24:05 EDT 2014 | spoiltforchoice
No, that's just weird. I have also never seen that in the UK. T.B.H I also get annoyed by the majority expecting you to arrange the movement of said machine from delivery truck to factory floor (particularly when they itemise the shipping at several
