Electronics Forum | Wed Jul 25 12:58:04 EDT 2001 | BGA rework expert
A key factor is underside Pre Heater ----- Conceptronics makes the best in terms of IR Preheat----- Most machines have forced convection from the top and bottom --- the preheater is the key on larger more dense boards. Placement accuracy is also bett
Electronics Forum | Mon Jul 30 05:43:24 EDT 2001 | andy
Hi - I'm looking at 5DX as a method for inspecting BGA joints and would like to hear from anyone with knowledge of this system . Can you tell me how reliable you have found it to be in catching BGA opens ? ...... also any other comments you may have
Electronics Forum | Wed Aug 01 10:28:11 EDT 2001 | btaylor
We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej
Electronics Forum | Wed Aug 01 10:28:24 EDT 2001 | btaylor
We have this problem with our High Temp. solder lines. Tombstoning is actually the term used in our facility. We found that the component termination width was a main contributor also profile ramp rates. Visual inspection will catch most of these rej
Electronics Forum | Sat Feb 05 12:36:09 EST 2000 | Albert Hay
Hello everyone, I am cosidering the possibility of using Low-Melt solder for repair purposes. However, I am concerned about adding a new alloy (agent) to the board that already has the No-Clean solder on it. Also, is the Bismuth in the Low-Melt comat
Electronics Forum | Fri Feb 11 14:11:51 EST 2000 | jseagle
To be more specific we have a single Contact 3AV that can run the board in question in 5 minutes from placing the board into the machine till the time it comes out. Volume is expected to be low initially but expected to pick up. It just doesn't fe
Electronics Forum | Tue Feb 01 12:00:01 EST 2000 | K. Ckak
Hi Folks, I am looking for some info. and possibly a source on measuring inprocess copper plating thickness for Flex PCB manufacturing facilities. I have tried XRF, E-Current method but the supplier told us that it wont work with Flex material - th
Electronics Forum | Wed Feb 02 09:58:00 EST 2000 | Dave
Ashok, I don't understand what they're saying about the gray joint. Usually a gray joint has to do with too much heat. Also, the higher the temperature the lower the fillet because of the increased viscosity of the solder. Correct? Wouldn't yo
Electronics Forum | Wed Jan 26 21:30:06 EST 2000 | Dave F
Tuan: Consider Sn 96.5/Ag 3.5 or Sn10/PB88/Ag02 also. As Glenn says, you had better get rid of that gold or you will never have a shiney connection. Not that a shiney connection means anything about the quality or reliability of your soldering. M
Electronics Forum | Wed Jan 26 12:36:22 EST 2000 | Franck Bourrieres
Where did you find a BGA 2000???? This machine is not saled anymore. The new one is the 3592 and include a large underboard heater which shouldn't be "under-powered" but this depend of the kind of board you are repairing. If you really want a large u
.gif)
