Electronics Forum | Wed May 08 11:07:54 EDT 2002 | Carol Stirling
We have a concern with moisture absorbtion/humidity effects on PWBs specifically used for automated SMT (including BGA). I'm sure there is a IPC spec on this and would appreciate the number - I've searched the IPC web-site -no results. Could you t
Electronics Forum | Thu May 09 15:30:57 EDT 2002 | TomN
I'd be a more than a little cautious about doing this. Had a somewhat different application once and found out that as the solution was cleaning/etching the surface, it also leached (thru the lead frame) into the body of the part. What we thought w
Electronics Forum | Tue May 14 15:49:30 EDT 2002 | dason_c
Thank! Francois. I think that I also had a paper from Lucent, Handling of Highly-Moisture Sensitive Components. Is it the one which you mention above? I just would like to figure out. Per Desiccant type dry box, it claim that it can absorb the m
Electronics Forum | Thu May 23 16:30:44 EDT 2002 | Mike Konrad
Solder balls can be removed with most cleaning systems, batch or inline. Ultrasonic will work but may also cause other problems. A high pressure spray-in-air cleaning system with a chemical additive (for no-clean removal) will work best. If you no
Electronics Forum | Tue May 28 14:01:09 EDT 2002 | zanolli
Hello Sally, The force required for press fit connectors will vary depending on the connector type. The force will also very significantly from one supplier to another for the same connector. To give you an example; for a .100" DIN 41612 connector
Electronics Forum | Tue May 28 13:25:57 EDT 2002 | zanolli
Hello Anthony, The amount of solder that the process is capable of applying is the biggest limitation. I believe that solder paste is only approx. 50% metal by volume. When connectors are soldered in intrusive reflow, often the stencil is "overprint
Electronics Forum | Tue May 28 17:33:31 EDT 2002 | wilcoxito
We are just getting started doing BGA assembly at our plant. Any helpful hints would be greatly appreciated. My first main question is about stencils. We are considering using diamond shaped holes for the BGA pads. Does anyone have any experience
Electronics Forum | Wed May 29 17:17:49 EDT 2002 | wilcoxito
As far as aperture dimensions go, I found a technical note written by Micron that recommends using "square apertures with sides equal in length to the diameter of the PCB pad. The corners of the square should also be slightly rounded, and the apertu
Electronics Forum | Wed May 29 19:00:08 EDT 2002 | russ
Have been seeing a pretty fair amount ourselfs. it seems to come and go. Couple of questions 1. Are the parts shifting to one side during reflow? 2. is it true non wetting to the component? I have been experimenting with different pad geometries a
Electronics Forum | Fri May 31 14:36:12 EDT 2002 | russ
does anybody have any info on what the minimum kV power should be on an X-Ray machine to handle general BGA inspection? I have heard that you need a minimum of 100 kV for the Metal top packages but have also heard of people using 50-60 kV but I don't
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