Electronics Forum: alsos (Page 716 of 1037)

Reflow profiler / mole /Thermal Couple

Electronics Forum | Fri Apr 02 10:23:38 EST 2004 | mapell

Hey Matt We manufacture reflow equipment and use all types of profilers. We currently use ECD, KIC, and DataPaq in our testing depending on how our customers want to see the data. In my experience they are all good systems. I have not really ru

MSD Bake Ovens

Electronics Forum | Thu Apr 15 01:51:52 EDT 2004 | kmccarten

Hi Haritt; In response to your request to information regarding cabinet manufacturers I would invite you to look at http://www.drycabinets.com which could give you some interesting if not valuable information regarding the functionality of desiccant

No Lead BGA Hot Gas Rework

Electronics Forum | Mon Apr 12 07:44:50 EDT 2004 | wgaffubar

Former company we use to replace No Lead BGA's by using dot dispense to apply eutectic solder to pad with same volume the stencil printer. Current company process removes bad BGA, wicks off solder paste then Hot Gas Reflows new No Lead BGA to bare pa

Type 4 solder paste

Electronics Forum | Mon Apr 12 15:52:12 EDT 2004 | wgaffubar

I am using Indium 92J type 4 solder paste due to a BGA site with .008" pads and stencil opening of .009" square and .005" stencil thickness. When I try the type 3 we get insuffecient print. The aspect ratio tells me that I should be using a type 4. T

Type 4 solder paste

Electronics Forum | Wed Apr 14 05:44:36 EDT 2004 | hun

Hi All, Just have a share with you guy. We are using T4 solder paste and also E-Stencil. We ahd try out Alpha, Kester, AIM and Qualitek. The result show Alpha had a very very heavy stack flux and can't get it clean off even by chemical

Stencil cleaning

Electronics Forum | Tue Apr 13 19:47:05 EDT 2004 | davef

Glue has different mechanical, thermal, and electrical properties than solder. That's why all these very nice no-lead people are furiously trying to gin-up some wacky solder alloy, rather than using glue. Among the papers in the SMTA Knowledge base

Faults Associated with Pumice Scrub

Electronics Forum | Thu Apr 15 11:14:34 EDT 2004 | mikecollier

Our conformal coat area has recently requested changes to our bare board houses to perform a pumice scrub operation on the PWB prior to HASL plating and delivery to us. Our first lot received caused us to have void faults under multiple component ty

Thermocouple calibration on reflow oven

Electronics Forum | Fri Apr 16 07:34:10 EDT 2004 | Claude_Couture

Ken, thanks for your answer, it is much better presented than what I was fed by our qc. By "calibrating TCs" I meant the readings the controller is displaying on the screen. So that would be the converter that we would check and calibrate. Thank you

qfp reflow problems

Electronics Forum | Thu Apr 15 17:06:08 EDT 2004 | russ

What are your temps at the locations that you are having trouble with. We cannot tell anything by the zone settings of an oven. We need max temp, how long above liquidous etc.. a lot of times this symptom is due to too long of a soak at too high o

qfp reflow problems

Electronics Forum | Fri Apr 23 13:31:20 EDT 2004 | russ

The toes of leaded devices are problematic in fillet formation. A lot of the time they have the copper from the lead exposed so it becomes oxidized and won't readily take solder. Normally this is of no concern if the heel and side fillets are forme


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