Electronics Forum | Fri Jun 24 17:08:13 EDT 2005 | franciscoioc
Hi Everyone, I need everybodys help on this one. We are a company that suppose to be exempt from the Lead-Free world and we were happy untill we find out alot of the Components manufacturers will change their parts to Lead-Free but not their part nu
Electronics Forum | Mon Nov 27 18:50:48 EST 2006 | darby
G'day Marina, Only YM/CSM seies feeders will fit these machines. Feeders were generally prefixed as Y8, Y12 = mechanical advance 8mm, 12mm. There may be some Y16 in existence but I doubt it. HA12, HA16 = air activated 12mm, 16mm. The HA12 could take
Electronics Forum | Tue Jul 05 11:00:37 EDT 2005 | patrickbruneel
Inds, This will happen with all lead-free alloys having a tin content above 70%. It takes about 30 sec. for a molten lead-free alloy to totally dissolve a copper pad. The higher the temperature the shorter the time and visa versa. The scary part of
Electronics Forum | Thu Jul 07 18:10:20 EDT 2005 | russ
You should use Xray to qualify your process. Frequency of Xray inspection after that will need to be determined by your process capability. If you use paste inspection process, once you verify that your profile and placement are good you in theory
Electronics Forum | Thu Jul 14 09:42:36 EDT 2005 | saragorcos
Our facility helps customers clean no-clean soldered boards on a regular basis, and it definitely can be done but is a little more challenging than boards built with water soluble flux - one piece of advice I would give is to use low water pressure (
Electronics Forum | Mon Jul 18 09:35:42 EDT 2005 | stepheniii
If it were other machines I would suggest the possibility of air kiss blowing the solder away, but mydata's have a release to make sure the air kiss never gets too high. Unless it is not pointing 90 degrees away from the machine like mydata recommend
Electronics Forum | Wed Jul 20 02:48:43 EDT 2005 | grantp
Hi, What's really interesting about your photos is there is solder paste on top of the component. If it was blowing the solder off the board you would see solder paste splatter away from the component. But the solder paste is on top of the compon
Electronics Forum | Tue Jul 26 08:20:46 EDT 2005 | Bob R.
All you can do is try it. I did a literature search last year on causes of BGA voiding and came up with a pretty long list, sometimes contradictory. I also discussed it with several paste suppliers. What I came away with is that what aggravates voi
Electronics Forum | Tue Aug 09 11:57:11 EDT 2005 | Board House
Hi Ted, I am a Sales Manager for a Circuit board Manufacture in MN. We have seen the Majority of our Customer base switch to Enig do to shelf life issues of silver and Tin. Silver, Tin & OSP all have a shelf life between 6 - 8 Mos. Enig is betwee
Electronics Forum | Wed Aug 17 04:46:02 EDT 2005 | rlackey
Pat, I wouldn't wipe my backside with the UK regulations, devised by the British civil service, home of humanities graduates & academic advisors who'd never cut it in the real world. We're also infamous for mis-interpriting european legislation, as