Electronics Forum: alternate (Page 36 of 108)

ERSA versa as alternative to wave soldering in low vol high mix

Electronics Forum | Mon Aug 29 11:47:25 EDT 2005 | stalkerb

Do you have expierience of this type of Machine. approx how many product types are you running on your wave/ersa...? and approx batch sizes We have had a 5060 for about 1 year and it has been a revalation. your input is appreciatted as i am consi

ERSA versa as alternative to wave soldering in low vol high mix

Electronics Forum | Tue Aug 30 15:29:17 EDT 2005 | pr

I agree with cmiller on almost everything except the fluxer. I have not found that to be the slowest part of the process. On a slightly populated board, preheat will be the biggest cycle time killer. On very highly populated boards, time spent at the

ERSA versa as alternative to wave soldering in low vol high mix

Electronics Forum | Mon Sep 05 05:47:32 EDT 2005 | stalkerb

We have found the service to be OK, however we are in Western Europe. We do have a local Agent for ERSA, and things were a little slow at first.........however we now deal directly with a contact in the Factory. This seems to work out well.

ERSA versa as alternative to wave soldering in low vol high mix

Electronics Forum | Thu Sep 15 06:59:33 EDT 2005 | Adam

Hi, No we did not look at Pillerhouse, We were not particular fond of "moving the product" principle to selective (i.e using a gripper over a static nozzle), as often this requires pallets, and our sister plant had already completed testing which a

Wrinkles on soldered BGA ball joints

Electronics Forum | Fri Sep 30 10:07:44 EDT 2005 | davef

Alternate explanations are: * Your reflow profile needs to be tweeked. * Bumps under a die look different than elsewhere on the package. Severe creases may indicate a problem, but creases of only a 0.001 to 0.002" deep should not pose any difficulti

Water Jet Stencil Cut

Electronics Forum | Mon Oct 03 14:14:06 EDT 2005 | Carmichael

My findings were that it wasn't accurate enough to create the crisp aperatures needed for release. That was almost ten years ago when everyone was looking for an alternative to chem-etch however. Water guided laser also showed promise of doing this b

Alum Electrolytic Caps

Electronics Forum | Mon Oct 10 20:06:59 EDT 2005 | nuezmaster

Does anyone have any experience running Aluminum Electrolytic Caps with a SAC305 alloy. The profile for the solder calls out a peak temp of 235-255C and 60-75 seconds above 217C. Most can cap manufacturers are calling out for 230-245c max for no lo

SMT tape boards!

Electronics Forum | Fri Oct 21 08:19:15 EDT 2005 | Jim

We are experinecing adhesives left on the boards after running taped boards for placement verification on NPI. We've been using 3M double sided (333) tape for over 15 years. Any other suggestions on a good tape to use? This may be a quality issue

Screen Printing Print Validation

Electronics Forum | Tue Nov 01 08:50:26 EST 2005 | James

I've recently been subjected to a procedure that requires the first 2 solder paste prints of a production run to be wiped down and not used for the build. This is to condition the stencil aperture walls? and insure good print deposition. Is this a

X7R woes

Electronics Forum | Mon Dec 26 12:58:17 EST 2005 | davef

As an alternative theory to the boards being damaged in the wave soldering process, it's possible that the panels are being handled in a way that flexes the panel and breaks the capacitors. In this possibilty, we'd expect capacitors in specific loca


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