Electronics Forum: alternative (Page 91 of 108)

Which solar panel brands have you used in the past?

Electronics Forum | Sat Jan 14 09:46:41 EST 2023 | symakhan

Hey Guys As an architect, I'm pioneering a house project and have already created all the blueprints. Now it's time to construct! Even though I understand the fundamentals of electrical engineering, there are certainly more intricate components that

My700 Alternatives

Electronics Forum | Tue May 16 09:46:25 EDT 2023 | tommy_magyar

Being a user or former user of both machines (user of Mycronic MY600, former user of Essemtec Scorpion used for adhesive dispensing), it really depends on the need of your business. We use the Mycronic jet printer for multiple processes: SMT printing

Samsung vs other manufacturers

Electronics Forum | Fri Jun 02 06:16:20 EDT 2023 | calebcsmt

As a user of Samsung (Hanwha) machines for close to 10 years now, we have yet to have any major issues at all. We've also personally not come across any component we weren't able to fairly easily place/recognize. I definitely agree that some other

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian

| | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 10:09:17 EDT 1999 | Earl Moon

| | | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However,

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 15:01:05 EDT 1999 | Dave F

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Re: HASL - again?

Electronics Forum | Fri Jun 18 14:28:14 EDT 1999 | Scott Cook

| | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave revi

Re: Stencil Cleaning

Electronics Forum | Fri Mar 12 18:12:15 EST 1999 | B. Walton

Spray cleaners are poor alternatives to todays ultrasonic stencil cleaners. Ultrasonics are the way to go and you can use rather benign water based chemistries to get the job done. As for screening adhesives and cleaning glue residue with spray wands

Re: Tin-Lead thickness on PWB's

Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach

| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F

| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol


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