Electronics Forum | Fri Nov 07 18:26:05 EST 2003 | jsloot
Is anyone using .062 aluminum circuit boards with copper conductors in your production lines? What kind of reflow profile is required? What special considerations are there to be looking for? I am asking for any information you can give me. Thanks
Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef
Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend
Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini
Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.
Electronics Forum | Thu Mar 03 09:29:12 EST 2005 | jdengler
This sounds like you are using a straight ramp profile. For this type of an assembly you may need to use a soak type profile. Most solder paste providers show you both types of profiles that work best with that paste. I would try using that profil
Electronics Forum | Thu Mar 03 10:59:37 EST 2005 | Rob
Also try boosting the bottom zones up to get extra heat in. Now try this at lead free temperatures & watch them go pop as the air inside expands & vents at the base. O to be in America & be free of our wonderful european decision makers.
Electronics Forum | Sun Mar 02 12:16:29 EST 2003 | ramanandkini
Recently, one of our new vendor supplied us PCBs with Electroplated Nickel and Gold. We have the other regular source giving us ENIG plating. In both the wirebonding quality is OK. How do we benchmark this? Which one is suitable for production with l
Electronics Forum | Sun Mar 02 17:40:02 EST 2003 | MA/NY DDave
Hi It sounds like you are in a different country or in the USA a long time ago. I have no idea of the process either is using, so they can be comparable or one can be better than another and lop sided compared to other places. Benchmarking I think
Electronics Forum | Thu Mar 03 08:42:07 EST 2005 | cyber_wolf
I just ran into a reflow profiling problem with a new assembly that we are processing in SMT. There is a cluster of six or so electrolytic caps that measure approx. .710" wide by .660" tall. They are spaced .100" or so apart. When I run a profile, t