Electronics Forum | Sat Feb 05 09:13:39 EST 2000 | Dave F
Hany: In response to your questions: 1- In a double wave solder M/C, is possible to completely eliminate the second wave without affecting the quality of the solder joints? Many w/s machines have a turbulent wave and a smooth wave. The turbule
Electronics Forum | Thu Jan 13 15:19:51 EST 2000 | Dave F
Hey Jack: It's certainly "do-able." Conformal coating adhesion testing was done as part of the "Evaluation of Low Residue Soldering for Military and Commercial Applications: A Report from the Low Residue Soldering Task Force," published by Sandia Na
Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron
Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu
Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.
Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to
Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ
Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to
Electronics Forum | Wed Dec 01 13:19:52 EST 1999 | Wolfgang Busko
Hi Dick, first of all I will not judge what�s the best in your case for I don�t know all details of your situation. Just my opinion: As a matter of fact the amount of THT is rapidly decreasing compared to SMT. So, to stay in assembly business it vita
Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau
hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:
Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F
Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.
Electronics Forum | Fri Nov 26 09:13:10 EST 1999 | Wolfgang Busko
Jeff, Ted, Stefano What Stefano is saying sounds reasonable. With entry-level systems its always a struggle to get sufficient results. The operators golden hand is needed. Better controlled advanced dispensing systems should do the work, unluckily I
Electronics Forum | Fri Nov 12 08:55:43 EST 1999 | Wolfgang Busko
Hallo Edmund, what does dull mean in your case ? It�s nearly impossible to say something about it without more information. Dull or shiny isn�t a clear or better no indicator for good or bad. Some companies add other metalls to the solder to get rid