Electronics Forum: amounts (Page 146 of 170)

Re: 2% silver solder paste

Electronics Forum | Thu Apr 22 17:19:57 EDT 1999 | JohnW

| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t

Re: DI water

Electronics Forum | Fri Apr 02 11:18:02 EST 1999 | Scott McKee

| | We've been using a newly installed DI re-circulating system. | | It's been a big headache. Mostly understanding what causes our resistivity to be unpredictable. I think I've got a handle on that part now. The system consists of a Carbon,HMR(cheal

Re: Black spots on gold finish pads.

Electronics Forum | Tue Dec 01 07:24:44 EST 1998 | Earl Moon

| Hi folks , | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspection

Re: Black spots on gold finish pads.

Electronics Forum | Tue Dec 01 07:54:49 EST 1998 | kallol chakraborty

| | Hi folks , | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspec

Re: Wave Solder balls

Electronics Forum | Mon Nov 02 22:57:02 EST 1998 | Kelly Gossman

Micheal, What does your profile look like for the wave? What profile does your flux say you need? My guess is it is not your profile, our testing with solder balls found that the mask on the boards was the largest contributor to solder balls. Wha

Re: Wavesolder solder balls

Electronics Forum | Mon Nov 02 17:45:46 EST 1998 | ChrisK

In my experience, solder balls are normally caused by only a few things. In order of likelyhood: 1) Water based fluxes (VOC-Free)not having the water carrier completely dried from the board before going into the solder. I.E, too fast conveyor spee

Re: fuji feeders

Electronics Forum | Tue Nov 03 12:21:53 EST 1998 | phillip hunter

| Thanks for your reply. | I am interested in knowing about maintenance schedules and levels. I'm wondering how to know if I must replace a part. What part? What type of lubrication (for Fuji). Etc. | My company is small in terms of number of lines

Re: Plating Processes

Electronics Forum | Fri Oct 30 01:07:34 EST 1998 | Earl Moon

| I am a recently graduated Process Engineer. I am working for a company developing and manufacturing printed circuit boards. I am looking for a web link, magazine article, book, etc which describes the processes which happen at a board house. More s

Re: Voids - correlation with a not wetting PCB

Electronics Forum | Mon Oct 12 08:07:45 EDT 1998 | Earl Moon

| I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. | | Is there a techn

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach

| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material


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