Electronics Forum: amounts (Page 161 of 170)

Swatch Group Granted Lead Exemption?????

Electronics Forum | Tue Apr 24 09:12:07 EDT 2007 | patrickbruneel

I want to say one more thing on this; many times RoHS is compared to the CFC elimination. But there is a huge difference between the two for following reasons: In late 80�s scientific evidence became available that CFC�s contributed greatly to the o

Solder wave

Electronics Forum | Mon May 07 11:09:49 EDT 2007 | davef

4 Fluxer Operation 4.1 Set-Up and Check-Out the Fluxer 4.1.1 Spray Fluxer Set-Up and Check-Out 4.1.1.1 Pass a sample unsoldered board through the machine. 4.1.1.2 Remove the board just after passing through the fluxer and the air knife. 4.1.1.3

Solder wave shutdown

Electronics Forum | Thu May 24 13:14:59 EDT 2007 | mfgengr

The answer is simple...kind of. The short answer in terms of total cost (if you don't run an air conditioner) is there is no difference. The technical answer is: The First Law of Thermodynamics - Conservation of Energy applies. You have an entire s

Comformal Coating Stripper

Electronics Forum | Mon Mar 03 17:42:35 EST 2008 | tonyamenson

I stripped the entire board because I had to have the boards troubleshot. Had a high failure rate from the field. The board coating was applied about 5 months ago. I was told by my people anything past 3 days and you will need this type of stripper

reflow profile development

Electronics Forum | Tue Sep 09 12:05:44 EDT 2008 | tonyamenson

First and fore most is to find your paste manufacturer spec sheets. Read it over several times and let it all sink in. Then call them with questions as they want to keep your business so their engineers want to help you use their product. I assume y

Question of delamination in PCB

Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef

From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff

BGA Placement Process

Electronics Forum | Thu Mar 25 09:14:09 EDT 2010 | krish_bala

Hello, I have been having some troubling issues when it has come to BGA Placement and I was hoping if there have been others who have been able to resolve similar issues. We are curently doing reworks on a variety of BGA, but seem to be having issu

ICT testing to improve yields

Electronics Forum | Mon Aug 27 08:58:24 EDT 2012 | rway

Reese, > > We would agree about the value of an > ICT system, in a general manufacturing > environment. However, a couple of notes > apply: > > 1. ICT isn't a catch-all, either, and > should be used to verify the process, not > validate it.

First time Pick and Place Machine

Electronics Forum | Tue Jul 18 09:29:54 EDT 2017 | svfeingold

That does sound like a great deal Tsvetan. Can you share any information about who/where exactly you purchased the machines, and which printer/reflow you have? I do have friends and colleagues in China that could ease the process if anything is comin

Differentdefect on circuit board surface

Electronics Forum | Fri Jul 10 07:34:00 EDT 2020 | elijah

From the poor bonding strength of the board, the surface quality problems of the board are divided into: 1. The cleanliness of the board surface; 2. The problem of micro graphite (or surface energy) on the surface. PCB circuit board proofing Youke bo


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