Electronics Forum | Sun Jul 26 20:54:40 EDT 1998 | Masdi Muhammad
Hi, Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subjecte
Electronics Forum | Mon Jul 27 08:42:13 EDT 1998 | Justin Medernach
| Hi, good friends | I found this site is so wonderful to learn SMT techniques meaningfully. | We now employ 3 Fuji GL-541 dispensors and raw material with Soma IR-120. but we found glue string casually. From my experience from trouble-shooting the c
Electronics Forum | Tue May 26 13:01:40 EDT 1998 | Earl Moon
| Regardless of what various inspection standards state, has anyone got any information on how the strength of a soldered joint changes with the amount of solder in contact with the legs. ie if there is 0.152um depth of contact how does the joint st
Electronics Forum | Fri May 22 11:12:25 EDT 1998 | Mike Glenn
| | Does anyone know about low pressure/low temperature | | ovens used for baking of moisture senstive | | components? | | Thanks | I need to know from where your need came. I usually just bake in conventional ovens with specified times and tempera
Electronics Forum | Mon Apr 13 12:11:41 EDT 1998 | Justin Medernach
| | | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusiv
Electronics Forum | Tue Apr 07 09:51:31 EDT 1998 | Gary Simbulan
Good Morning everyone. Per repeated suggestions I have been reading back issues of SMT and Circuits Assembly magazines. I have just read an article concerning selective wave soldering which I understand is to be used when active SMTcomponents are a
Electronics Forum | Mon Mar 30 12:51:40 EST 1998 | Justin Medernach
| Hi | Anybody got advice on the online storage of sensitive ICs. ie dessicator cabinets with Nitrogen or dry air. I am looking at Nitrogen, but it is a costlty option. Appreciate any inputs. | Rgds | Liam Liam, Depending on the amount you need store
Electronics Forum | Wed Mar 25 17:11:20 EST 1998 | Mcox
| We are having some problems with "drawbridging" on 0805 film capacitors. | We have already reduced the pad width from .050" to .040" based on input | from vendor. Defects appear to be random as far as location on the PWB and direction | of placem
Electronics Forum | Wed Mar 11 10:58:58 EST 1998 | Earl Moon
| | What does the term "poor wetting" mean as a defect code ? "Poor" should mean unacceptable when surface (component or PCB solder termination areas) wetting does not provide acceptable solder joints. Unacceptable wetting of PCB solder termination
Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett
You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa
