Electronics Forum: amps (Page 1266 of 7890)

Baking boards

Electronics Forum | Tue Jun 13 12:00:15 EDT 2000 | Brian Larson

How long and at what temperature to you bake through-hole boards for moisture? I am getting blow holes after the wave solder. Everything points to the drilling of the board, but I need to prove that it is not moisture.

BGA Reballing

Electronics Forum | Wed Jun 07 16:34:09 EDT 2000 | CJ Bonifas

Are there any other manual reballing systems aside from the one made by Hepco that use a vacuum method for ball placement?

Cooling of elctronics

Electronics Forum | Tue Jun 06 18:36:21 EDT 2000 | Mohsen Esmailpour

Which direction is the industry moving to for cooling high-end electronic devices/boards? Is there anything innovative taking place beyond liquid cooling and refrigeration? Is anyone developing cooling techniques which are integral part of the devic

Component staking

Electronics Forum | Tue Jun 06 13:19:31 EDT 2000 | ZAKIR AHMAD

Our company do electronic packaging for space applications. One of the problems we face during our design is whether or not to stake/bond the surface mount components to the board to survive the vibration qualification environment. If we do staking

Re: Component staking

Electronics Forum | Tue Jun 06 13:41:16 EDT 2000 | Charles Harper

I would like to refer you to John W. Kratz, author of Chapter 8, as listed at the top of the forum. John is the outstanding specialist in this subject area.

Re: Large SCI

Electronics Forum | Tue Jun 06 13:08:01 EDT 2000 | Charles Harper

I suggest contacting Dr. Jennie Hwang, author of Chapter 6, as shown as the top of the forum. Jennie is outstanding in the solder reliability subject area.

Homologous Point

Electronics Forum | Tue Jun 06 13:02:25 EDT 2000 | Keith Luke

In the Chapter 3 on "Thermal & Mechanical Stress," Harry Charles mentions a "homologous point" in 3.5. We are unfamiliar with this term. What is this point? What are the implications of solders in operating environments below their homologous poin

Re: Homologous Point

Electronics Forum | Tue Jun 06 15:01:10 EDT 2000 | Charles Harper

The homologous point is the temperature midway betweeen the melting temperature (of the solder) and absolute zero. Below this point the solders are harder, stronger, and more resistant to fatigue. As solders are exposed to higher temperatures above

interchangeable stencil frame systems

Electronics Forum | Wed May 02 13:42:54 EDT 2001 | pzohbon

Does anyone know of any interchangeable stencil frame systems? We use Alpha's Metals Smart Frame system,but it is heavy and cumbersome. Also, are there any quality issues that prove the interchangeable system is not as repeatable as the permanently

interchangeable stencil frame systems

Electronics Forum | Thu May 03 16:44:42 EDT 2001 | davef

I'll leave that to others, but this is far more interesting ... http://www.madsci.org/posts/archives/aug2000/965825243.Ph.q.html


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