Electronics Forum | Mon Jun 18 12:24:59 EDT 2001 | ashokdha
Gil I had come across two different Mechanisms of X-Raying cards / card assemblies: Transmission and Laminography. Can you elaborate on pros and cons for these methods and if there is specific application (s ) to which these are specified ? Cost im
Electronics Forum | Mon Jun 18 18:09:22 EDT 2001 | davef
Help us understand how these two types of equipment compare, in terms of things like: range of application; types of problems they would be used for; cost in terms of purchase price, operation, facilities, etc; technical skills required; etc.
Electronics Forum | Mon Jun 18 12:31:21 EDT 2001 | ashokdha
Gil For BGA Inspection, What are the other technologies available to us ( e.g. infrared ? ultrasound ? laser ? Mirrors ? ) Can you provide your perspective on that ? How safe and cost effective the X-Ray system is as compared to other methods of i
Electronics Forum | Tue Jun 19 20:42:49 EDT 2001 | davef
So, they want you to talk through a justification for mixing fluxes? That's GREAT, if you can get away with it!!! Tell us more about Safety Clean.
Electronics Forum | Wed Jun 20 11:43:11 EDT 2001 | genny
M.G. Chemicals "Safety Wash Cleaner Degreaser". A primarily ethanol / methyl alcohol product. Part number "405". Brushes, Kim Wipes, or cotton swabs have all been used from time to time to apply it to the PCB.
Electronics Forum | Tue Jun 19 18:14:04 EDT 2001 | davef
So when xray inspection time becomes excessive, what things can happen? What are the warning signs that inspection times could be getting longer than they should be?
Electronics Forum | Wed Jun 20 16:09:21 EDT 2001 | Gil Zweig
Clearly, x-ray inspection should not become a bottleneck in the production process. The concept of "signature" identification is to rapidly qualify a BGA attachment as acceptable or suspicious. If suspicious, the board is taken off line for further s
Electronics Forum | Mon Jun 18 18:17:10 EDT 2001 | davef
What to you consider to be the minimum resolution [micron] for: General, BGA, die attach uBGA, flipchip, wire bonds Wire cracks, delamination Microcircuit failure What is the relationship between resolution [micron] and the kV of the tube?
Electronics Forum | Wed Jun 20 15:56:33 EDT 2001 | Gil Zweig
For the applications you mention you would probably want to resolve details of at least 8 microns (0.0003") which would translate into a bare minimum resolution requirement of 60 to 100 line pairs per millimeter at a minimum geometric magnification o
Electronics Forum | Mon Jun 18 18:18:43 EDT 2001 | davef
Finding and troubleshooting cracked BGA solder connections are a real pain in the neck. Please describe how xray fits into this process, the type of machine used, and how that machine is used in conjunction with other equipment.
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