Electronics Forum | Wed Mar 26 16:05:13 EST 2003 | davef
Ren�: Look here to get started with you efforts: http://developer.intel.com/design/Quality/component/rework.htm
Electronics Forum | Thu Mar 27 11:49:18 EST 2003 | kenlchin
In printing,the thickness of solder paste perpendicular to the Squegge direction is always lower 1 mil than that parallel to the Squegge direction,so Insufficient Solder may occur.I think you may slow printing speed or widen appertures to resolve it.
Electronics Forum | Sat Mar 29 07:07:01 EST 2003 | mk
http://www.sipad.com/Motorola/MotorolaFlipChip.htm Check out this link. Sounds similar. mk
Electronics Forum | Sun Mar 30 20:21:44 EST 2003 | iman
we are using a "recommend supplier profile", and we have gotten back to the talking table with them over this profile specs. Thanks for the pointer, have ask them on this issue. Have also asked for their phase-transistion diagram to understand their
Electronics Forum | Mon Mar 31 06:53:09 EST 2003 | mk
http://www.sipad.com/Motorola/MotorolaFlipChip.htm Should work, I just tested it. mk
Electronics Forum | Wed Apr 09 09:44:12 EDT 2003 | iman
yes, we r profiling direct thermocouple attachment to the LGA pads. based on direct experience of yourself or others, what paste (brand/type3?/type4?/alloy?/flux%?) gives the optimal repeatable characteristic-patterns to minimize this defect?
Electronics Forum | Mon Mar 31 14:15:05 EST 2003 | ksfacinelli
I am also interested in anyones obervations. I am most interested in anyone changing over from ws-609 to ws-709. I have read the technical information but I am most interested in hearing from a user.... Thanks, Kevin
Electronics Forum | Tue Apr 01 19:21:25 EST 2003 | Myu
I'm a user changing over from WS-609 to WS-709. WS-709 has less voiding problem and longer stencil life than WS-609. Ws-709 has a less foaming during washing process. Thanks, Myu
Electronics Forum | Wed Apr 02 10:51:17 EST 2003 | kmorris
Myu: Did you have to change your reflow profiles when you changed from 609 to 709? What ramp rate & time over liquidus are your profiles at?
Electronics Forum | Tue Apr 01 19:45:48 EST 2003 | mk
Try checking into ssd www.sipad.com No clean process for the whole board. Contamination from paste is removed before you get the boards. http://www.sipad.com/Motorola/MotorolaFlipChip.htm mkehoe@sipad.net