Electronics Forum | Wed Feb 02 16:24:14 EST 2005 | bobsavenger
I would like to know if anyone has an IPC specification for BGA's handy? I'm looking for specifics based on Classification. Roundness, %voids, size, etc. Please let me know if you have this. Thanks Bob
Electronics Forum | Thu Feb 03 13:49:42 EST 2005 | johnw
yip loads of times but to be fare it can happen with any feeder check the pb port tracks on the mfu sometimes the track shorts after a chip blows
Electronics Forum | Thu Feb 03 14:34:30 EST 2005 | jdengler
I had 1 of the feeder connectors on the MFU develope a short which blew 3 IC's before I found it. Good Luck Jerry
Electronics Forum | Fri Feb 04 05:42:45 EST 2005 | paul_fisher
We are looking to convert our Tenryu programs to Europlacer and wonder if anyone has either a viewer for the Tenryu files or knows of a conversion program that is available?
Electronics Forum | Fri Feb 04 12:56:38 EST 2005 | Mark M
I think everyone has answered these over and over again. Try doing a search on forums for Lead free and you would be surpised of the results.
Electronics Forum | Fri Feb 04 15:42:34 EST 2005 | Indy
Do a search for SAC305. There will be lots of answers. Jay Brower has done good work on it. Cheers Indy
Electronics Forum | Tue Feb 08 07:11:24 EST 2005 | teilo
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Electronics Forum | Sun Feb 06 12:59:33 EST 2005 | GC
Please try to use 6-8 mils ..you are overloading pads surface ..Please verify paste volume vs surface..Have fun
Electronics Forum | Mon Feb 07 12:47:18 EST 2005 | Indy
1. use 6-7mils stencil. 2. reduce aperture opening to 60-70% of pad size. 3. check viscosity of solder paste. According to that you might want to alter your print speed and pressure. Cheers Indy
Electronics Forum | Tue Feb 08 06:43:56 EST 2005 | dhanashekar
we have even tried with 6mil stencil even than we are getting the solder ball thanks for your suggestion