Electronics Forum | Tue Dec 19 23:09:25 EST 2006 | laxminarayana pai
Well, you need to change your solder paste.There are pastes available in the market which are meant for ICT pin testability.
Electronics Forum | Wed Dec 20 18:26:28 EST 2006 | sjlevin@ix.netcom.com
We use a solvent called AK-225ATE (there is also AK-225T) that works great for removing RMA flux residue and no-clean flux residue. Info at http://www.AK-225.com
Electronics Forum | Wed Nov 29 20:49:14 EST 2006 | davef
According to J-STD-033B, 3.1 Requirements: The levels are determined per J-STD-020 and/or per JESD22-A113 plus reliability testing. Look here: http://www.jedec.org/download/search/jstd020c.pdf
Electronics Forum | Wed Nov 29 10:31:19 EST 2006 | dougs
Hi, Just wondering what, if any, design rule checks each of you do prior to running new products. Comments from contract manufacturers particularly welcome. regards Dougs
Electronics Forum | Wed Nov 29 12:10:07 EST 2006 | realchunks
We have a 70 page check we use. Just need to verify the board layout can be processed thru all required processes.
Electronics Forum | Wed Nov 29 16:03:09 EST 2006 | darby
Chunks, After how many pages of non-conformance does the boss tell you that you really don't have to make it?
Electronics Forum | Thu Nov 30 05:08:40 EST 2006 | aj
5mm. 3.Check that there are fiducials. The above checks are purely for Processing the board thru the machines. There are lots of other checks for stencil design etc. aj...
Electronics Forum | Wed Nov 29 10:48:37 EST 2006 | bas Rottier
Hello, I'm looking for a protocol description of the SMPI interface (we would like to connect a SMPI machine to a SMEMA machine). Does anybody have description of signals (electrically) + waveforms + pin-layout + connectortype? THanks Regards bas.r
Electronics Forum | Wed Nov 29 20:35:47 EST 2006 | davef
Fine SMTnet Archives are amazing. Look here: http://www.smtnet.com/Forums/index.cfm/fuseaction/view_thread/CFApp/1/Thread_ID/6759
Electronics Forum | Wed Nov 29 14:49:38 EST 2006 | MS
Any recommendation to reduce solder beads next to 0402, 0603 and 0805 caps and res? What about home plate vs. bow tie stencil aperture design?
