Electronics Forum: amps (Page 2446 of 7888)

Help me to impress my boss

Electronics Forum | Mon Apr 02 22:09:14 EDT 2007 | diesel_1t

Nobody responds on my other thread, but basically a home-made software solution is what I was looking for reel replenishment on fuji equipment. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=11593&mc=2

Help me to impress my boss

Electronics Forum | Sun Apr 08 04:56:07 EDT 2007 | ST

Hello, for Siemens HS-180 you can found a modern software solution here: http://www.treplace.de Happy Easter ST

Starting SMT home company.

Electronics Forum | Thu Mar 29 09:40:08 EDT 2007 | tammyanne

I'm starting a surface mount company. Can anyone suggest good start up equipment? Temp controlled solder iron, microscope/ magnifying lamp. Any info would be helpful. Thanks.

Cad to Fuji MCS

Electronics Forum | Thu Mar 29 09:45:36 EDT 2007 | jeffjarmato

Does anyone know where to get the software that will convert and send CAD data from a PC to the Fuji MCS? Fingers are getting tired of typing all data into MCS.

LGA Processing

Electronics Forum | Thu Mar 29 21:47:41 EDT 2007 | davef

PCB land to part land ratio - 1:1 Stencil aperture size - 1:1 with PCB land Stencil aperture shape - same as PCB land

LGA Processing

Electronics Forum | Fri Mar 30 23:07:13 EDT 2007 | mika

And how about the queston: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=11592&mc=7 We face a big problem with this matter right know. /

re: BGA REWORK EQUIPMENT ( LARGE VOLUME PRODUCTION)

Electronics Forum | Fri Mar 30 05:06:32 EDT 2007 | aram

Dear ALL , i wish to know about the suitale BGA rework station for the large volume production-pls share ur best knowlede.

re: BGA REWORK EQUIPMENT ( LARGE VOLUME PRODUCTION)

Electronics Forum | Fri Mar 30 14:50:49 EDT 2007 | GS

Brand: Air-VAC (US) ZEVAC (if outside US) - Onix 24 - Onix 29 the high capability and capacity Best Regards....GS

CSP and BGA soldering difference.

Electronics Forum | Wed Apr 04 18:27:53 EDT 2007 | Guest

Most CSPs are BGAs. Some are sent without bumps or balls. Thjos eneed to be bumped prior to processing for best results

CSP and BGA soldering difference.

Electronics Forum | Fri Apr 06 01:10:16 EDT 2007 | Haris

My SMT line does not has these facilities so would you please tell me regarding the UNDERFILL AND FLUX-DIP process and how they can be done? Thanks.


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