Electronics Forum | Mon Dec 15 12:42:18 EST 2008 | bandjwet
Dear Smtnetters: We have a customer wanting to strip off or overplate a gold microplated connector with tin (gold disposal too difficult) . Does anyone know if this is feasible? Regards BWET
Electronics Forum | Tue Dec 16 06:59:47 EST 2008 | janz
Hello, I am looking for technical papers (tips, tricks. machines, materials etc) for MID assembly (Moulded Interconnect Device - 3D assembly). Regards Janz
Electronics Forum | Tue Dec 16 17:07:46 EST 2008 | stepheniii
NEW ban proposal? It was exempted from ROHS and that exemption was lifted during the summer. I made a post about it no longer being allowed back in July. Here's a link I posted. http://www.rsjtechnical.com/NewsDecaBDE.htm
Electronics Forum | Wed Dec 17 11:28:22 EST 2008 | patrickbruneel
Stephen, You're absolutely correct I totally miswrote the post. What I wanted to highlight is the efforts from the reachforlife organization. Decision making should be based on scientific evidence. http://www.reachforlife.eu/home.php?lg=UK
Electronics Forum | Wed Dec 17 11:25:38 EST 2008 | davef
dots of minimal height. So, use a lower viscosity adhesive. * Higher standoff components => larger (and taller) dots. So, use a high viscosity [typically, also high yield point] adhesive.
Electronics Forum | Wed Dec 17 13:25:38 EST 2008 | evtimov
I am printing on DEKs and using simulara paramateres as for a solder it works really fine. In general going faster gives you more paste/glue. Less pressure gives you more paste/glue again. All the rest depends on your current board. Regards, Emil
Electronics Forum | Wed Dec 17 13:34:15 EST 2008 | jorge_quijano
Ok, thanks for the info, fortunatelly we already have our Camalot glue dispenser machine In-line with our MPM, for helping whit the high stand-off components.
Electronics Forum | Thu Dec 18 21:09:06 EST 2008 | cadfamily
Welcome to http: //www cadfamily com supply EDA/CAM Learning Tutorial free download!!! For example:Mentor Graphic,Cadence,PowerPCB,PADS,ORCAD,AGILENG,ANSOFT,SYNOPSYS,ZUKEN,GENESIS,VA LOR,UCAM,PARCAM,VXWORKS,TONARDO,ACTEL,ACTIVE-HDL,FPGA ETC.
Electronics Forum | Fri Dec 19 11:57:29 EST 2008 | robinj
Experts, Any advise on Hot Bar Soldering.I'm relatively new to this process.What are the pros and cons as opposed to using connector?
Electronics Forum | Mon Dec 22 10:24:06 EST 2008 | ck_the_flip
Yes I agree with Emil that the Jig/Fixture design is crucial for alignment. The hot-bar machine I worked with came with a digital camera and monitor to aid with alignment. Other than that, the right profile (heat, pressure and dwell), and a good fl
