Electronics Forum | Thu Mar 08 22:24:45 EST 2001 | davef
Sounds like you've done a good job of troubleshooting. Two thoughts are: 1 An alternative to using a hotter flux that the others mentioned is to use components with more solderable terminations. [A firm grasp on the obvious.] 2 You spoke about
Electronics Forum | Fri Mar 09 08:25:13 EST 2001 | CAL
We have seen some problems with component end cap solder terminations not being symetrical. i.e. If one end on the cap has a larger solder ternination this sometimes is enough surface area during reflow to lift the opposite side of the component. We
Electronics Forum | Wed Mar 14 08:43:39 EST 2001 | genglish
Dave is absolutely right, your adhesive supplier must give you a data sheet with a precise cure profile on it. We use a cure profile like a trapezium shape with a max temp of 150�C for a period of 120 seconds but this is totally dependant upon the a
Electronics Forum | Mon Mar 12 04:29:15 EST 2001 | Hon Choi
We've got some products at the sample run stage that we are using hand soldering to assemble and the results are terrible, especially in the reliability of the product. I found this one company that has a machine that places the part AND laser solde
Electronics Forum | Mon Mar 12 18:14:44 EST 2001 | reconsales
We stock over 3000 used Panasert feeders and have many parts in stock. We can also repair / calibrate your feeders with our PFA factory alignment fixture. Please provide us with an accurate description of the parts you need. Give an accurate descri
Electronics Forum | Thu Mar 15 21:29:06 EST 2001 | davef
That you can solder the test points with a little extra flux and a good blast of heat makes me think there is nothing fundamentally wrong. I'd guess there is oxidation on some test points that is a little crustier than others. You might be able t
Electronics Forum | Thu Mar 15 08:25:12 EST 2001 | Glenn Dody
I am currently in San Jose working on a BGA assembly problem in a customers subcontract house. I do consulting in this exact kind of work with years of experience trouble shooting PC board assembly problems especially with BGAs. I am booked up unti
Electronics Forum | Wed Mar 14 17:33:42 EST 2001 | davef
Check Bob Willis' site. He calls this Single Side Multipass Endothermic Elongated Happy Reflow Soldering, er someting like that. Ha ha ha!!! Naw, he calls it Simultaneous Double-Sided Reflow Soldering. That might be something like you are talking
Electronics Forum | Wed Mar 14 21:05:59 EST 2001 | davef
Mike makes a very good [ no, make that excellent!!!] point about reflowing solder at the same time you are curing glue. There is some evidence that the outgasing during the cure of glue can affect the LT reliability of solder connections. [Regardles
Electronics Forum | Thu Mar 15 16:58:11 EST 2001 | mparker
The only way I know of waving the bottom side with SMT parts installed without epoxy would be to use a masking media, Kapton Tape, wave pallet that keeps those parts from being susceptible to gravity once the connections are reflowed. If there is ano
