Electronics Forum | Tue Jun 30 20:04:21 EDT 1998 | Steve Gregory
| Thanks a bunch........ We all enjoy using and visiting the forum....keep up the great work. | | Wayne Clifford, What Wayne said...abso-tively true! This IS the best place to talk shop...I learn a great deal from this list. Hope to see it con
Electronics Forum | Mon Jun 29 11:11:44 EDT 1998 | Ryan
| Mornin' everybody! | We are located in Lansing, Michigan and are looking for a company to test our wave machine solder content on a regular basis. Does anybody know of a local company that will do this? Can we do it ourselves cheaper? Thanks aga
Electronics Forum | Fri Jun 26 11:15:21 EDT 1998 | David Spilker
I have been asked to evaluate the use of and SOT-23-6. I guess that this part has been around for awhile, but I have never used one. It looks straight forward enough, but I was wondering if anyone out there in forum land has found any special issue
Electronics Forum | Thu Jun 25 15:35:41 EDT 1998 | Edmund Ong
Hiya! I'm a postgraduate student in Coventry Uni. Currently, I'm doing a project titled "Optimising SMT Throughput Time". Therefore, I'm looking for an appropriate algorithm as a reference to suit my project. The type of Algorithm I'm looking for is
Electronics Forum | Thu Jun 25 13:00:41 EDT 1998 | Bill D.
I have a 2-up panel measuring about 8" x 8" with a score for depanel throuch the middle. I see warping after reflow of the panel (bending in/about score line). The board is not framed (i.e., supported) during SMT reflow other than on the conveyor thr
Electronics Forum | Fri Jun 26 09:35:46 EDT 1998 | David S.
| I have a 2-up panel measuring about 8" x 8" with a score for depanel throuch the middle. I see warping after reflow of the panel (bending in/about score line). The board is not framed (i.e., supported) during SMT reflow other than on the conveyor t
Electronics Forum | Tue Jun 30 12:06:04 EDT 1998 | Michael Fogel
| | I have a 2-up panel measuring about 8" x 8" with a score for depanel throuch the middle. I see warping after reflow of the panel (bending in/about score line). The board is not framed (i.e., supported) during SMT reflow other than on the conveyor
Electronics Forum | Wed Jun 24 18:50:55 EDT 1998 | John Silvestri
Has anyone seen a problem with solder under chip components, in-between the glue and the component or in-between the mask and the component? We seen both. What could be causing this? This has only been detected on one of our products. All the rest w
Electronics Forum | Wed Jun 24 14:20:53 EDT 1998 | Ben Salisbury
I know this topic has probably been talked about before...But I ran into a small situation where Solder Balls were appearing in large quantities on the PCB....the Problem has been isolated and taken care of, my question is, what are some good methods
Electronics Forum | Wed Jun 24 09:23:35 EDT 1998 | Chris Kelly
What is your current solder pot temperature? Whatever that temperature is, has it been verified/calibrated? What kind of flux is being used? No-clean, OA, RMA? How is the flux being applied to the PCB? Is this problem occuring on ALL negative termi
