Electronics Forum | Tue Sep 04 08:40:45 EDT 2001 | caldon
I have input about EMPF but my opion is biased. One thing I can tell you that is a fact- the classes are 40% theory and 60% "hands-on". The 60% "hands-on" utilized the latest in manufacturing equipment. No hotel conference room, training is done r
Electronics Forum | Tue Aug 21 13:20:47 EDT 2001 | LloydG
Greetings! I would appreciates any inputs to all tech pros & Engineers: As responsible for manufacturing engineering for our PCA products(OEM/Telecom) am planning to implement a company-wide implementation of DFM/DFT. Am looking for a software that w
Electronics Forum | Mon Aug 27 22:48:21 EDT 2001 | dougk
Used an older model of the one you described. Have used Asymtech and Fuji's as well. The Camalot is accurate, reliable, and easy to program. The only things I disliked about it was that is was slower than the fuji's, and if the pressures weren't set
Electronics Forum | Wed Aug 22 17:00:51 EDT 2001 | Doug Chambers
I am researching articles with respect to intermetalics growth associated with gold as a final metalization. We are currently looking at a few options that include a 10uin flash followed by a 30uin selective and a total 30uin finish. The concern is
Electronics Forum | Mon Aug 27 10:09:50 EDT 2001 | gresko
Steve, Depending on the type of equipment you are using for P&P you may want to consider placing and processing the substrates in Auer boats. I have provided many applications for ceramic substarate users using purchased Auer boats or machined palle
Electronics Forum | Thu Aug 23 12:23:51 EDT 2001 | mkallen
I don't see anything in IPC-6012A specifically about stretch. Maybe paragraph 3.4 (Board Dimensional Requirements) applies, which tells me I need my own drawing note. Crafting this note could be tricky, and I was hoping that someone has already tac
Electronics Forum | Thu Aug 23 11:55:21 EDT 2001 | wbu
TA, is there somebody out there who can bring on the right track according adequate materials for long term storage of assembled boards (at least 10 years)? It�s for spare parts for future service exchange. The units should be stored seperately and
Electronics Forum | Thu Aug 23 15:43:24 EDT 2001 | mparker
Have you considered vacuum package in ESD bags, just like the way the IC's are packaged? What about conformal coating for the units being stored? 10 years is a long time for End of Service life of a product. You may need to get accelerated life testi
Electronics Forum | Thu Aug 23 13:29:07 EDT 2001 | morefun
Some of our other divisions have had to do epoxy underfill with BGA devices to obtain adequate reliability for aerospace applications. Are there any special layout considerations required to ensure that we can do underfill if we deem it necessary du
Electronics Forum | Thu Aug 23 20:31:53 EDT 2001 | davef
We never underfill BGA, but then again our products are not blasted into space. Certainly you need to provide enough room for the dispense head to move around the component in the pattern appropriate for the underfill you plan to use. Probably more
