Electronics Forum | Fri Oct 04 12:02:53 EDT 2002 | mzaboogie
Hi Barry, One consideration that you may want to consider is the lead to hole ratio. The higher the ratio, the less solder is required to fill in the gaps and give you a fillet. Heat is a concern. You will need to ensure components will take the he
Electronics Forum | Wed Oct 02 12:16:21 EDT 2002 | dragonslayr
Dave- thanx for the suggestion and I have already downloaded the catalogs of both companies you mentioned. I am trying to narrow down the list for the BGA patterns most commonly seen vs. the shotgun approach of making one of everything, just in case.
Electronics Forum | Tue Oct 01 16:50:26 EDT 2002 | dragonslayr
Just checked the archives with no real success so I am asking here. Are there recommended no clean pastes for SMT reflow of BGA's? Seems to me in recent threads a pro and con issue of whether or not to use no clean for BGA's is raised. The BGA in
Electronics Forum | Wed Oct 02 11:44:58 EDT 2002 | slthomas
We found that a slightly more active flux was all we needed to provide sufficient wetting on the one AgPd part we put down. Unfortunately the paste we tried also slumped terribly, so we nixed that fix. It's a low volume product (50, once every 3 mo
Electronics Forum | Thu Oct 03 09:53:08 EDT 2002 | Jim Gryga
I am looking for a software package that can provide me with a ballpark estimate of labor time required to assemble electro-mechanical products. The inputs that I imagine would include number and size of fasteners, number of wire connections, number
Electronics Forum | Fri Oct 04 11:25:49 EDT 2002 | Bob Willis
If you want some additional material on 0201 design and assembly the SMART Group Committee produced one of its Charity Reports with all the money raised going to the Red Cross USA September 11th Appeal. You can get it from the SMTA Main office, it fe
Electronics Forum | Mon Oct 07 11:35:08 EDT 2002 | John
We use home-grown java based software to turn our remstar shuttles. Manages 8000 different part numbers on 3000 feeders. We are able to generate recipes which turns our shuttles and operators pull our feeders. Just did 5600 change outs in a 16 hour d
Electronics Forum | Tue Oct 08 09:17:13 EDT 2002 | davef
Who knows? Whats does Siemens say? Try: * Embedded Systems Journal http://www.embedded.com/ * RTC http://www.rtcmagazine.com * SEI Web forums at Carnegie Mellon University Software Engineering Institute http://www.sei.cmu.edu/sei-home.html * IEE
Electronics Forum | Wed Oct 09 17:50:09 EDT 2002 | alj
Wrong..! It is a money loser for Teradyne and it will be cut in the future. Wow, auto thermal profiling.. Gee, that is a little late. When will the summit platform be redesigned. It's the same thing they sold 10 years ago with a few modificati
Electronics Forum | Tue Oct 08 20:06:03 EDT 2002 | peterson
What is the procedure for insuring that our solder is not contanimated in our wave solder process if we switch between water soluable and no clean solder. We switch between the two types on the same machine during consecutive shifts. Should the entir
