Electronics Forum | Mon Nov 29 10:13:02 EST 2010 | vetteboy86
My research starts here. I'm just beginning to research the effects of using a leaded part in a no lead process. Before I began, I know there are temperature differences. The part in question has a 260 C spec. Next I would like to find out if any c
Electronics Forum | Wed Dec 01 04:42:48 EST 2010 | aungthura
Thank you, Patrick and Hege I now more understood about no-clean and RMA. Yes, I agree with Hege the no-clean makes PCB look pretty dirty however the soldering looks good and shinny. To wash out RMA flux, I may need chemicl cleaning, am I right? Cu
Electronics Forum | Tue Nov 30 17:47:25 EST 2010 | ck_the_flip
1.) Are there any industry white papers written that document any advantages in running this alloy? From what I've read, this alloy was formulated to prevent leaching of silver for silver-bearing component terminations. 2.) Are there any concerns w
Electronics Forum | Fri Dec 03 04:20:18 EST 2010 | grahamcooper22
Hi In Dec 2008 the IPC J STD 004 was updated to 004B, and I am wondering what the new test conditions are for testing flux Surface Insulation Resistance and Electro Migration Potential within the new spec. I am looking for the recommended test temp
Electronics Forum | Fri Dec 17 09:47:51 EST 2010 | rwyman
Recommend upgrading to their Windows version. Will require a new PC and simple mod of a control bd (cuts and jumpers and an EPROM swap) but we did (10+) machines about 10 yrs ago. The ones we still have are still going strong. You probably won't f
Electronics Forum | Fri Dec 03 20:40:38 EST 2010 | olddog
We are a small company looking to purchase a used Quad 4c to bring some of our PCB fab in-house. In looking around at equipment we see both 4c and 4c mk2 versions of the Quad machine. Can someone please advise the difference between the two? Thank yo
Electronics Forum | Tue Dec 07 10:57:29 EST 2010 | davef
Warpage tells you that design and/or fabrication process and/or assembly process need[s] to be corrected. Here's a link to a recent thread on SMTnet that seems to answer some of your questions: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_I
Electronics Forum | Mon Jan 10 18:22:43 EST 2011 | eadthem
What we use for boards the engineers made to big is aluminum flat bar 1/8 to 1/16 thick about 1 inch wide. we fold it in 1/2 so it fits snuggly on the pcb and just press it on the ends before reflow. id assume the same thing would work on wave but
Electronics Forum | Wed Dec 08 19:16:20 EST 2010 | jgalarza
Can anyone tell me if there is a formula for finding the after reflow height of solder with no part attached? I have to print some pads that do not have any parts but there can not be more than 1.5mil of solder on the pad after reflow. I am going to
Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp
You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for
