Electronics Forum | Wed Apr 26 02:16:18 EDT 2006 | AR
We had x-ray and optical microscopy analyses done on transformers dip soldered with Sn/Pb, SN100C3 and SN100C4 alloys using temperatures 400�C ... 450 �C, with dip times of 2..4 seconds. We found that SN100C4 is at least as good as Sn/Pb 62/38 and SN
Electronics Forum | Thu May 25 08:47:39 EDT 2006 | inds
Patrick, we were seeing a good amount of Cu-dissolution with both SAC305 and SN100C.. couldn't figure out.. till our good old vendors told us that the Cu thickness in the barrel were not correct... but anyway have started some new work with SAC30
Electronics Forum | Tue Jul 05 13:54:35 EDT 2005 | Sandeep
We are facing lot of problems with tombstoning in 0201 components. Ironically tomstoning in these components is not occuring while reflow but it is happening when we subject them to thermal cycling test. We have been investigating the cause and thoug
Electronics Forum | Wed Jul 06 04:27:30 EDT 2005 | aj
Javi, If the components are caps and resistors etc there should not be much problems. I would say everyone at this stage has a mixture of leadfree and lead components. The problem really starts when you are running the likes of Leadfree BGA where th
Electronics Forum | Wed Jul 06 20:15:51 EDT 2005 | Gary Bremer
The good old days weren't all that bad. When I needed to have a specification callout for a conformal coating on an engineering drawing, I just used MIL-I-46058, type UR (for example), and the drawing checkers were quite happy. Since MIL-I-46058 ha
Electronics Forum | Thu Jul 07 15:32:37 EDT 2005 | saragorcos
Hi Lloyd, Have you done any ionic analysis to find out what the flux residue is composed of? If you can eliminate the source residue, then your problem obviously should go away. Though tombstoning isn't known to be much of a functional problem it i
Electronics Forum | Thu Jul 07 18:16:36 EDT 2005 | russ
What size discrete components and have you evaluated your pad geometries? If pads are too far apart this will happen. The flux resudue is simply there because you didn't solder the component. It will stay on top of the solder bump. You can see this
Electronics Forum | Fri Jul 15 06:20:34 EDT 2005 | skandaae@vsnl.net
PLEASE SUGGST ME FOR A PROBLEM CAUSED DURING MY PROCESS In one of the product I am faceing one component tilt after tht reflow oven 1. check the thkickness of the paste found the paste was more reduse the thickness by adujesting the screenprintg s
Electronics Forum | Tue Jul 12 04:21:29 EDT 2005 | Chris Ong
Hi, Have anyone out there been using Asahi products. My knowledge is limited and I only know it from the http://www.asahisolder.com website. Pls feedback or share your view on the Asahi product. If this product worked better than other even if it h
Electronics Forum | Fri Jul 08 13:43:20 EDT 2005 | pjc
I sell in-line ATE/ICT systems. They are designed to identify passed or failed boards coming off the tester(s). You can do so with a 90 deg. diverter and an extra magazine loader. The ICT machine knows which has passed and which has failed, so it com
