Electronics Forum: amps (Page 5811 of 7890)

AOI: Agilent vs. Omron vs. MIRTec/YESTech?

Electronics Forum | Wed Dec 06 11:11:37 EST 2006 | devgru

Just my two cents, but our findings were that the Yestech system was more in-line with our type of high mix, mid volume manufacturing. In my research, I found the Yestech to be the most favored for our applications, with most contract shops I talked

AOI: Agilent vs. Omron vs. MIRTec/YESTech?

Electronics Forum | Thu Dec 07 21:04:25 EST 2006 | Cmiller

We have two YesTech machines. They are a great supplier and you should at least test thier machine and make the call based on what is best for you. I have also owned an Agilent machine and unless they have changed dramatically, I would not consider t

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders

Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 15:19:56 EST 2006 | CK the Flip

Mike, dude, I feel your pain. Hearing stories like this makes my blood boil! It's almost as ridiculous as a customer who told me to put more solder paste on a MELF component to overcome noise issues - he used more solder paste as antennas to overco

Smt 'pick and place' machine issues

Electronics Forum | Wed Nov 29 08:25:28 EST 2006 | aj

Hi, I work mainly with Fujis but have some experience with Panas. If you are seeing components upside down on the board it is feeder related . If you are seeing poor alignment across the board , firstly I would check the xy table for alignment. Mak

Flux residue cause high false reject at ICT

Electronics Forum | Wed Nov 29 01:25:53 EST 2006 | callckq

Dear All, I have 1 product that using solder bar from vendor called Asahi. After wave process, we found quite a sticky flux residue remain on the board. Eventually, have huge impact on our ICT fisrt pass yield(FPY). Current FPY is a the range of

Flux residue cause high false reject at ICT

Electronics Forum | Wed Nov 29 11:56:10 EST 2006 | CK the Flip

For the better part of my career, I've battled with ICT guys on so-called "flux residues" on their test probes, and this was when using NO-CLEAN, 2% to 5% solids tops, flux. People don't understand that ICT probe maintenance is an inherent part of

Flux residue cause high false reject at ICT

Electronics Forum | Thu Nov 30 19:55:30 EST 2006 | greg york

This may be worth checking out are you sure it is flux residue and not undercured plasicizers coming from solder resists due to the higher Lead Free temperatures killing the undercured resist, this causes many no faults found and bridging, solderball

Flux residue cause high false reject at ICT

Electronics Forum | Mon Dec 18 04:03:30 EST 2006 | greg york

Good solvent wipe will normally show some discoloration of the same colour as resist, but not scientific enough as you cant gauge the amount coming off, ideally none. But is an indicator of the issue. I have been meaning to do a swab with an indicato

Baking of MSD devices

Electronics Forum | Wed Nov 29 01:46:10 EST 2006 | hanocete

Hi! to all, Here in our company, we sometimes received BGAs and ICs that were packed poorly(not sealed), and no MSL level written to it from our suppliers, now we subject the material for baking before using it. We use J-STD-033B table 4-1 as our cr


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