Electronics Forum | Fri May 26 12:24:48 EDT 2000 | Steve Thomas
Greetings! I'm hoping that you can help me with a problem, possible due to my pea brain not being able to figure out how to work the site. When I do a search of the forums and get 250 hits, the only way I can see the last one is to go through the w
Electronics Forum | Thu May 25 17:41:29 EDT 2000 | John Thorup
Hello Jason Sorry that I can't be of much help as your part seems to be proprietary to a specific OEM manufacturer. I would guess that it is a Temperature Compensated Crystal Oscillator by the TCXO and the shape. This is basically a precision cryst
Electronics Forum | Fri May 26 02:22:18 EDT 2000 | Sal
Generally a good and safe option when selecting a printer, A rhobust machine with good process capabilities. We print anything from 0402's to CCGA's using proflow, as well as print adhesive with no problems. The 265 ranges from the MK1 TO Infinity mo
Electronics Forum | Thu May 25 17:18:45 EDT 2000 | Boca
I have not done pin in paste in production quantites, but speculation is always a blast so; OA fluxes are active at room temperature, they grow 'fur' with humidity if not washed off, great stuff for soldering, nasty stuff for reliability (if not rem
Electronics Forum | Tue May 23 20:37:22 EDT 2000 | Dave F
Gabby: Trying to avoid accusations of plowing new ground eh? Inert soldering: R Curthers et al, "Optimizing A No-Clean Circuit Board Process Using Nitrogen Inerting In A Conventional Wave Solder Machine," NEPCON West 1991 T Walsh, "The benefits Of
Electronics Forum | Tue May 23 09:01:21 EDT 2000 | Wirat S.
Dear all friend, I found problem of soldering bridging between SMT Chip terminal & Glue , but under the chip body. My process was double side SMT assembly with bottom side adhesive & heat curing, then wave soldering with water soluble flux (OS type)
Electronics Forum | Tue May 23 20:54:44 EDT 2000 | Dave F
Justin: Hey guy you still Mr. Prototype, Small Lot Size? Or have you move on to other things? We either print or dispense goop off-line. May be these guys can help: * TechnoISEL, 2101 Jericho Turnpike, NHyde Park, NY 11040 516.328.3970 fax 8827
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Electronics Forum | Thu May 18 23:22:44 EDT 2000 | Micah Newcomb
Jerry, Contact FujiAmerica and ask for their newest product Guide. Some differences are..... IP2 - SMD1 vision (back lighting only, coplanarity check optional) IP3 - SMD3 vision (back, front, coplanarity check optional) IP3 - BGA transport, I
Electronics Forum | Mon May 22 12:04:03 EDT 2000 | Michael Parker
80%. There are too many factors at hand to point the finger yet. We need to build a truth table and dot the i's and cross the t's before stepping up to Goliath (Samsung). Is you placement guranteed good? What x-ray have you used? Are your fab.'s know
