Electronics Forum | Tue Jul 31 23:32:59 EDT 2001 | me
Please excuse me if this question has already been answered, but what separates this type of tooling from say the Transition Automation "Board Lok" tooling (which I tried out and hated) or the DEK FormFlex. Since I am based in the UK I have a chance
Electronics Forum | Sat Aug 04 12:03:25 EDT 2001 | johnw
The reason we're putting the epoxy in at the last process is two fold really. 1. as you suggest putting the componnd down prior to placement is going to cause issues around the placement of the device. But more importantly 2. the material speced by
Electronics Forum | Mon Aug 06 12:14:35 EDT 2001 | seand
Hello All, The audacity to yell Smartsonic here is appauling. This is a process approach dependent on the type of epoxy. To suggest your equipment without knowing a thing about the process is shameless. OK, now I'll get off my soap box. The low
Electronics Forum | Tue Feb 08 12:39:52 EST 2000 | Ashok Dhawan
I have three questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opened only at time of use
Electronics Forum | Tue Feb 08 16:09:09 EST 2000 | dean
Generally speaking with most electronic grade epoxies: 1. Cure time is a function of temperature. 2. Polymer bonds begin to quickly break down above certain temperatures (product specific). I believe aprox 170-180C. The strength of the bond de
Electronics Forum | Wed Feb 09 21:29:28 EST 2000 | Dave F
Charlie: People cure glue using their paste reflow profile all the time. And most of them are happy. Personally, I�m with Dean and Travis. It�s possible to as you suggest, it�s appealing not to mess with your oven profile, but it just doesn�t s
Electronics Forum | Mon Feb 07 13:40:41 EST 2000 | Dave F
Jose: Those are good guesses. Without knowing more, ask yourself: 1 There is probably adequate heat available, but that portion of the substrate that�s not soldering well is not receiving proper heating. Why is the component getting so hot, relati
Electronics Forum | Mon Feb 07 19:49:50 EST 2000 | Tony Di Mauro
Jose, I have seen this defect before. We called it re-reflow. We found the part was originally attached at SMT. Later on after seeing a heat cycle at the wave machine the leads would de-attach causing an open at In-Circuit Test. Resolution was t
Electronics Forum | Sat Feb 05 09:01:15 EST 2000 | Dave F
JS: The issue is not how efficiently/effectively that you can run your placement machine, probably. The issue is how efficiently you can run that part of your assembly process that is the bottleneck. Other than improving quality, optimizing any pa
Electronics Forum | Mon Feb 07 13:20:03 EST 2000 | Dave F
Graham STOP!!! You can not be totally serious. A five year old cost model counts bean, and beans are beans. I have to know more about the calculation. If this bores some of your gear-heads, click on "return." � Help me with the terms: - "Ops cos
