Electronics Forum: amps (Page 6486 of 7889)

Re: bowtwist

Electronics Forum | Wed Jul 21 13:12:11 EDT 1999 | John Thorup

| I have pcb's in which i am experiencing warping. | the boards are 12.8125" on a diagonal measurement. | they are out approximatley .010". | the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what is the pr

Re: single pin connector (II)

Electronics Forum | Mon Jul 26 17:04:14 EDT 1999 | JohnW

| | | | Despite the goodness of Dave F. and George Verboven, I was unable to find the damned single pin connector. As a last attempt, I've draw it (see the link) | | | | If somebody knows where can buy it, please help me | | | | (and sorry for to

Re: testing after SMt assembly

Electronics Forum | Tue Jul 20 06:36:50 EDT 1999 | Peter Brant

| Dear all | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | Our appliocation is Mainly fabrication of mother boards. | Thanks | Hi, The usual method is ATE, also known as a "Bed of nails" Basicall

Re: Titanium finger

Electronics Forum | Mon Jul 19 05:40:57 EDT 1999 | HERMAN

| | My wavesoldering machine is equipped with Titanium finger. What composition of Titanium alloy used ? Any grade difference, and which is the best grade for long life ? An info or website concerning it. | | Dear Barden, | | Sorry, I am not fami

AOI for high mix low -mid volumes

Electronics Forum | Fri Jul 16 15:22:27 EDT 1999 | SMTASSY

We are currently looking at purchasing an AOI equipment but would like facts from present users of such equipment. Our envirronment is as followed, - Runs from proto to 5000 boards of the same type. - 20% PTH, 60% Mixed (with some BGA) and the rest

Re: Surface Mounting on Composite Epoxy Materials (CEM - 1)

Electronics Forum | Thu Jul 22 02:58:25 EDT 1999 | George Verboven (Process Engineer)

| We are considering adding surface mount components to a board we currently produce. The board is made from CEM-1. Has anyone had any problems with surface mounting to this material? We use a glue/place/cure process. | | Thanks in advance, | |

Tomb Stoning

Electronics Forum | Fri Jul 16 10:55:54 EDT 1999 | Jeff Ferry

We have been asked to rework several thousand bare circuit boards. A design change now requires 2 chip components where 1 was originally required. Round test pads near this area will be used to complete this circuit rework, however these test pads a

Re: Tomb Stoning

Electronics Forum | Thu Jul 22 03:58:28 EDT 1999 | George Verboven (Process Engineer)

| We have been asked to rework several thousand bare circuit boards. A design change now requires 2 chip components where 1 was originally required. Round test pads near this area will be used to complete this circuit rework, however these test pads

check feeder cpt tracking on SMT lines

Electronics Forum | Fri Jul 16 09:49:25 EDT 1999 | Ronan BERTON

Hello, i'm looking for informations about companies which are using system to verify the loadind of a SMT machine by using barcode (on the slot on the machine & on the reel). I'm in charge of the installation of this kind of system. I expect to have

Re: How to start a selective soldering process

Electronics Forum | Fri Jul 16 14:42:36 EDT 1999 | Glenn Robertson

| I'm planning to introduce selective point-to-point soldering for pwb. This is due to various needs: PIHs assy on double IR, for example. I think the most suitable solution is a point-to-point soldering, 'cause we're still having small lot/many type


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