Electronics Forum | Wed Feb 23 15:19:49 EST 2005 | Dilbert
I don't work on quads but I can give you some things to look for... Each of the moving axis work off a motor that is controlled by a "drive". Some of these drives have a fault or error output that is connected to the motion controller. One of your
Electronics Forum | Mon Jun 13 19:07:57 EDT 2005 | bobpan
Mike, Right down all the settings you have for your machine (this may take a while). Also back up the programs you want to save. Now....if i can remember correctly.....when looking into the black computer box from the back of the machine...in your bo
Electronics Forum | Fri Feb 25 16:34:53 EST 2005 | jimmyb
In your PDs you must specify a single nozzle size. Meaning don't assume that entering nozzle size max=1.3 and nozzle size min=1.3 forces the machine to use a 1.3. Nozzle size min is not used in the CP6 software (it only uses nozzle size max), there
Electronics Forum | Wed Mar 09 10:20:02 EST 2005 | Keith
Hello Deyo, With regards to schematics for these boards, SigmaPrint Technologies Ltd as the authorized provider of spare parts for the SMTech range of Equipment have these drawings on file along with all other SMTech manufacturing drawings. Sigmapr
Electronics Forum | Sat Feb 26 20:44:46 EST 2005 | siverts
Some of the QFN's have/has? (sorry for the grammatics but I live in Sweden) a "ground pad" underneath the center of the body. Some of the manufactories have made a specification of how much solder fillet that needs to be covered on the center pad [f
Electronics Forum | Mon Feb 28 12:01:30 EST 2005 | Bob R.
We use QFNs in automotive products and have done a good bit of experimenting with pad designs, paste patterns, stencil thickness, and thermal via patterns. All of them have an effect on assembly and thermal cycle reliability. There is not a yes or
Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc
Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components
Electronics Forum | Mon Feb 28 11:31:08 EST 2005 | russ
This sounds a lot like a profile that is killing flux activity prior to wave immersion. What is your topside preheat temp just prior to hitting the wave? What type of preheat do you have, convection or radiant? Are you using a chip/turbulent wave
Electronics Forum | Mon Feb 28 13:13:25 EST 2005 | russ
ING, you had to nake it difficult didn't ya! It appears that all of your parameters are okay. When you state that "sometimes there is a residue" is it liquidous or dry? Is your spray fluxer an ultrasonic or a spray gun head? You may not be getting
Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj
The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i
