Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Wed Aug 09 19:14:15 EDT 2006 | Board House
Our Manufacturing policy regarding welds is as follows. 1) Inner layers - depends on Core thickness and line width. Our shop will not do any welding on core thickness less then 5 mils. or line width less then 5 mil. Good AOI practices reduce the a
Electronics Forum | Wed Aug 09 08:46:48 EDT 2006 | pavel_murtishev
Good afternoon, Take my word, bent THT leads will surely cause problems with manual/automatic component insertion, and surely will create voids in solder joints. As a rule, PIH components are placed by hand and good PIH THT manual component placemen
Electronics Forum | Fri Aug 11 14:48:00 EDT 2006 | flipit
Hi, I live in Minneapolis,MN USA. I was watching the news last night and began to laugh. There was a news story on the benefits of silver in fighting infection and healing. I know first hand that silver fights bacteria. I set myself on fire worki
Electronics Forum | Tue Aug 15 20:41:54 EDT 2006 | davef
Alpha UP78 was a modern solder paste. Check with your supplier for recommendations. You're are cleaning some flux residue with the IPA and reducing the leakage current. We're not wild about using IPA. Problems with IPA are: * IPA / material being
Electronics Forum | Sat Aug 12 20:47:50 EDT 2006 | Efren
Hi Guys, A few months ago I posted a question about a New Assembly Line, and It was great the answers I received. Now I would like to have an additional advise, to complete the requirements of my financial. We expect to install approximately 6 Pick
Electronics Forum | Thu Aug 17 23:24:34 EDT 2006 | guest
I suggest you do the ff prior the machines arrival at your site. - Get all the dimensions of purchased machines from their catalogue. - Lay out / draw their footprints in the manufacturing floor. - Drop down air and power supply. Unpacking, level
Electronics Forum | Sun Aug 20 21:43:19 EDT 2006 | darby
Yes, I agree with guest. Lay it all out with masking tape on the floor. Include the width of feeders sticking out. Confirm the position of power, air, network and smema connections. You may even want to use cardboard layed out on to the floor. You ha
Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS
Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125
Electronics Forum | Wed Aug 16 03:48:24 EDT 2006 | umar
Hi All SMT Net Team Member, I always have problem at MY SMT process and production side, Every time product running at my production side always found a lot solder Ball issue near the pad of SMT chip component. We had quite hard to do the trouble s
