Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Tue Dec 26 12:35:09 EST 2000 | Dave F
Your English is fine. Your assessment that corrosion on a portion of the metalization on the end of a component is causing the tombstoning is reasonable. We've seen that before. Corroded components received from a supplier is not acceptable as an
Electronics Forum | Wed Dec 20 21:01:12 EST 2000 | Dave F
Talk about glam jobs � About once a month, we�d go over to the slaughter yard to get cows� teeth for Dr. Mueller. Then we�d fixture them on their side and run them in a machine that scrubbed them with a brush for weeks. The cool thing about cows te
Electronics Forum | Wed Dec 20 22:24:03 EST 2000 | Greenman
Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d
Electronics Forum | Wed Dec 20 22:25:26 EST 2000 | Greenman
Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d
Electronics Forum | Wed Dec 20 22:26:01 EST 2000 | Greenman
Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d
Electronics Forum | Fri Dec 15 09:48:25 EST 2000 | CAL
WOW!! I about coughed my false teeth when I read your posting. KUDOS to you Dave. You are right empfasis is great because it is a technical publication written by Engineers and Scientist for Engineers and Scientists.Since you opened this can of worms
Electronics Forum | Thu Dec 14 12:18:01 EST 2000 | genny
Hello all, Our company has always used HASL finish on our products. Recently however, we have a had a problem on a couple of boards that I have been told cannot be avoided with HASL, and we should switch to ENIG(electroless nickel immersion gold).
Electronics Forum | Wed Dec 13 14:15:54 EST 2000 | Chris
I have a product where an IC is soldered using a stencil which puts down way too much paste. The result is massive bridging. Anyway, one of my coworkers claimed he could eliminate the bridging by baking the circuit board in an oven for 5 min at 90
Electronics Forum | Wed Dec 13 11:11:20 EST 2000 | CAL
CONFUSED???? The the "BIG-chip-in-the-middle" on my image is IC732. IC304 is the 52pin QFP to the right of the "BIG-chip-in-the-middle".If it worked when the "Thingy" was there and does not work when the "thingy" is not there good indications are you
