Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Wed Mar 25 14:05:18 EST 1998 | Justin Medernach
| We currently use an abrasive fiberglass brush to clean the silver oxide off of our substrates proir to asembly. It's messy and tiring. Is there an alternative method, either chemical or mechanical that is cost effective for small (30 to 50ea 6in
Electronics Forum | Tue Mar 17 11:57:39 EST 1998 | Richard
| Jim and all, | I am with SMTnet and want to thank all of you for | your participation in the SMT Forum. The recent slow | down of the forum was caused by three factors: | 1. The amount of data has increased. We keep | 3 months worth of messages
Electronics Forum | Mon Mar 30 16:39:04 EST 1998 | Tony Arteaga
Hello there, I am currently doing BGA repair and basically I am applying the same process as Mike sujested. It is actually the way to go when creating a profile. The next process is re-balling your package, that is if you whant to use the same compon
Electronics Forum | Fri Mar 01 08:35:27 EST 2002 | caldon
I am on board with Dave F.(like I usually am). I can not imagine what IPC specs the auditor is speaking about. The Stencil Design criteria, 610, and 001 do not fit the type of solder deposition you speak of (nor I think they should). The machine para
Electronics Forum | Tue Jun 18 23:34:28 EDT 2002 | kenbliss
Todd, I am unaware why you are clearly irritated with me. I am just trying to help you and anyone else that I feel I have information or ideas that could be of use, if my ideas are not useful to you please ignore them. You are clearly unaware of my
Electronics Forum | Wed Nov 06 15:47:49 EST 2002 | bpan
Hello All, Having a problem during reflow and would like your opinions. We are using Kester r562 water soluble paste and I am using a Kic 2000 profiler in a 4 zone oven (top only). We are seeing poor wetting or fillets that are not "passable" per IPC
Electronics Forum | Thu Nov 21 05:44:07 EST 2002 | kcorrin
We produce several boards with reflowed components on top and bottom. We are finding the solder has wetted to the leads but did not flow completely to the end of the lands. Several factors/causes?: 1) Board warping but paste deposits look good. 2) Mo
Electronics Forum | Thu Feb 27 11:05:49 EST 2003 | Chris
Hello, I am the manager of a Drafting department and don�t pretend to know too much about the SMT process. But I am the manager of a CAD designer so I am somewhat responsible for the following issue. So since no one else around here seems to have the
Electronics Forum | Tue Apr 01 18:42:18 EST 2003 | rdr
Well, here is what I have found so far. I have removed the top of the BGA and found that the ball had detached from the package. Three balls were removed with the two adjacent balls pulling the pads off the board and stayed attached to the BGA while
