Electronics Forum | Thu May 22 08:46:05 EDT 2003 | Henry Lee
Hi I uploaded the photos http://hk.photos.yahoo.com/ee02lyk of the failure samples. The chip-cut and pin-hole were found after the manufacturing process. I initially suspect the crack happened during the reflow process.However, our factory analysis d
Electronics Forum | Sun Nov 14 21:46:54 EST 1999 | Tuan Nguyen
I would like to know all the information about PCB assembly cost analysis. Anyone who has the information or know the source, please show me. I am very preciate about it.. The information can be Software, book, magazines, forum, and technical docu
Electronics Forum | Fri Mar 25 12:27:17 EDT 2011 | blnorman
In a previous life, we would send samples to our bar solder supplier and they would provide analysis. For contaminants, ICP (inductively coupled plasma) is a method we also used to determine composition. Google labs that have ICP capabilities.
Electronics Forum | Tue Jul 19 21:24:04 EDT 2005 | davef
This is a bit dated, but it'll give you a starting point. test lab failure analysis IC; Accurel Materials Analysis Group (FIB, FESEM,TEM) 785 Lucerne Dr Sunnyvale, CA 94086; 408-737-3892 Fax 3916 Suzanne Francisco X146 email@example.com test la