Electronics Forum | Fri Sep 15 14:29:10 EDT 2006 | bvdb
Thanks "j". There is absolutely no support for Fuji in New Zealand or for the older IP-1 and MCS/2 programming computer. We got the machine working by studying the FIP-1 Operation Manual and the MCS/2 Programming manual and a lot of trial and error
Electronics Forum | Wed Jan 17 11:21:29 EST 2007 | BillW
I have been using overall combined DPMO of SMT PCBAs as a performance metric. All defects are recorded down to component location and defect category. The resultant defect data table is analyzed with detailed pivot tables, defect type and defect loca
Electronics Forum | Wed Jun 18 12:56:31 EDT 2008 | ampearl
I need to find a qualified candidate to join a communications company in the SMT department. The project calls for an individual who has worked with product development building prototypes and testing them in an R&D environment, as well as workin
Electronics Forum | Mon Aug 04 16:20:35 EDT 2008 | patrickbruneel
After analyzing the pictures I don't think the solder balls are caused by the solder mask. If the problem would be solder mask related the solder balls would only show up on the solder mask but there are also solder balls on the plastic tabs. To me i
Electronics Forum | Mon Sep 08 14:29:04 EDT 2008 | davef
�Another direct measurement to determine resistivity values (i.e. of remaining no-clean residues) can be performed through impedance spectroscopy. The surface resistance underneath chip resistors and capacitors can be determined to show the improveme
Electronics Forum | Tue Sep 29 07:28:48 EDT 2009 | clampron
Sean, Is this the only chip component that exhibits this condition? Only one location or only one part number? What are you using for chemistry? (OA, No Clean) if the parts do not look like this when they leave, I would send a sample of an unprocess
Electronics Forum | Mon Mar 01 10:36:55 EST 2010 | patrickbruneel
Loco, Since Dave didn't respond i will. We shouldn't forget that even when using tin/lead solder the boards and components are still lead free. Parts that are not completely wetted by the tin/lead solder still have the potential for tin whiskering a
Electronics Forum | Wed Jul 14 15:36:34 EDT 2010 | remullis
98% to 99% pass yield should be your target. The previous company I worked for, we were able to meet these goals with most all of our products. It took us some years to achieve this level of pass rate. Of course analyzing and good reporting from some
Electronics Forum | Wed Sep 22 15:33:54 EDT 2010 | davef
Comments are: * First, no one is looking at your posting. You need to post in the 'SMTnet Production Forum' [top of the page]. This 'SMTnet Site Support Forum' is for whiners that want to complain to Neil about problems in logging-in, font that's to
Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
