Electronics Forum | Fri Jan 03 12:48:23 EST 2020 | cyber_wolf
Besides correct stencil design, solder paste chemistry can have a profound effect on voiding. People will tell you reflow profiles. I have never in my career seen a reflow profile have any effect on voiding unless it is grossly off.
Electronics Forum | Fri Jan 03 02:03:58 EST 2020 | sssamw
What's your target for voiding? I cannot see it violate 25% of solder joint area. Process setting and PCB design can impact the voiding, many factors, such as PCB pad, stencil aperture and thickness, re-flow profile, solder paste, etc.
Electronics Forum | Thu Jan 02 10:30:42 EST 2020 | emeto
thank you Steve, when you mention Stencil design, what do you refer to? How about the Reflow profile? Any specifics that I should look for. Everything is in my process window, but some detail towards this package might be very helpful.