Electronics Forum | Sun Jun 20 16:45:48 EDT 1999 | Chrys Shea
I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), and
Electronics Forum | Mon Jun 21 12:08:17 EDT 1999 | C.K.
| I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), an
Electronics Forum | Mon Jun 21 15:27:00 EDT 1999 | Tony
| I dug through my big box of office crap and found the disk with my technical papers. I posted the one on process control in the SMTNet library. It covers a lot of ground on what causes defects in the wave (too much or too little of something), an
Electronics Forum | Fri Jun 18 15:39:47 EDT 1999 | Earl Moon
| What's wrong with the Tin? Just wondering | | MDCox | | | | Electroless silver had promise, from Alpha, but I don't know where this ended up. Also Omikron's "white" electroless tin is proported to be a good alternative, though I've never been a
Electronics Forum | Fri Jun 18 06:54:43 EDT 1999 | Paul McMichael
A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for popc
Electronics Forum | Fri Jun 18 13:30:01 EDT 1999 | John Thorup
| A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po
Electronics Forum | Tue Jun 22 22:18:02 EDT 1999 | armin
Hi Graham, can u send me some conformal coating guidelines. i'm also interested ! my e-mail add is armin.tan@setec.com.au thanks | | Could anyone please give me any information or obtainable references concerning proper guidelines for the applica
Electronics Forum | Sat Jun 12 16:45:48 EDT 1999 | JohnW
| | | Does anyone out there involved in RF manufacture have any experience with the KIC Slim-Kic profiler? Do you find any interference problems between the RF transmissions and the testing of your products. We build primarily high-freq stuff like po
Electronics Forum | Sat Jun 12 17:41:13 EDT 1999 | JohnW
| | | Does anyone out there involved in RF manufacture have any experience with the KIC Slim-Kic profiler? Do you find any interference problems between the RF transmissions and the testing of your products. We build primarily high-freq stuff like po
Electronics Forum | Wed Jun 09 13:11:29 EDT 1999 | John Thorup
| In past PCB designs I have cleared all traces from all layers | (except pwr/gnd) from fiducial area. It has come to my attention that this is only necessary on the side where fud is placed. Which is the correct method of design using a fidicial?
