Electronics Forum | Tue Sep 23 15:02:05 EDT 2003 | serial_killer
I am currently looking at purchasing equipment and have narrowed it down to these two platforms. Does anyone have these machines or any input about them?
Electronics Forum | Thu Sep 25 04:19:40 EDT 2003 | Datum Dynamics
Hi Dave I think it might be difficult to get an off the shelf item. WE have designed and supplied several in the past, both pnumatic and manual, if we can be of any help please let me know.
Electronics Forum | Thu Sep 25 13:53:56 EDT 2003 | russ
There isn't any difference in the printing process regarding leadfree vs. lead. The only differences are in the reflow process. Russ
Electronics Forum | Mon Oct 06 14:39:20 EDT 2003 | dgjjr
I definately agree about OEM's skewing the data on such a proposed site. I was a service engineer for an OEM for 13 years and I know from experience; the marketing guys rake through these forums daily looking for any oportunity to promote the brand.
Electronics Forum | Sun Sep 28 16:06:21 EDT 2003 | Keith Petersen
I am a QA engineer in a telecommunications company. I am searching for both electrical and mechanical reliability standards that govern chip on board tests. Are there similar standards to IPC or JEDEC for COB in rugged commercial applications? I a
Electronics Forum | Wed Oct 01 13:42:00 EDT 2003 | rmurtuza
any one know of lead free seminars or training sessions tuned towards the training of implementing lead free processes on the shop floor
Electronics Forum | Fri Oct 03 05:50:53 EDT 2003 | kanwal324
All the packages like 0603,0402,0201 have half the width as compared to length but in case of 0805 package width is 50 mils instead of 40 mils. Is there any special reason designing point of view. Please tell if anybody knows.
Electronics Forum | Mon Oct 06 04:03:39 EDT 2003 | iman
Does the EIA standard recommend any standard PCB pad sizes (LxB)? and pitch-to-pitch (Pad) distances? Thanks for the advise.
Electronics Forum | Tue Oct 07 02:18:13 EDT 2003 | iman
Hi Experts, Pls help advise what is the expected range of PCB gold thickness over Ni (for ENIG/Electrolytic fabrication processes)? any referrence standards set by the IPC?
Electronics Forum | Fri Oct 10 13:35:56 EDT 2003 | swagner
Does anyone have any data about the dangers of reflowing BGA's twice? I have a customer that is concearned about cracking in the intermetallic layer after the second pass. Thanks in advance.
