Electronics Forum | Fri Oct 16 21:07:31 EDT 1998 | Scott McKee
| I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? |
Electronics Forum | Sat Oct 10 09:01:46 EDT 1998 | Al Carrillo
| we currently have a siplace line(80s/f) and are inhereting a fuji line from another site. I need an objective comparison between the two. What are the strengths and weaknesses of the fuji with regard to programming, operating and maintenance. any c
Electronics Forum | Wed Oct 07 22:40:05 EDT 1998 | Eric R.
Came a cross an interseting observation/question. I'll need to filter additional information and specifics to those whom may be able to assist me. But for now; I use a water soluble base organic flux manufactured by Kester (the exact solution will
Electronics Forum | Wed Oct 07 15:25:02 EDT 1998 | Joe P.
Hi Everybody | | Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. | We have alread
Electronics Forum | Tue Sep 29 16:45:00 EDT 1998 | Clifford Peaslee
| Hello all, | We at SMTnet are ready to introduct a new and improved forum. I am sure all regular users will find | it substantially more useful than its predecessor. | The forum will be shutdown between 3 and 4 EST. Any messages submitted during th
Electronics Forum | Tue Sep 15 13:30:40 EDT 1998 | Dave F
| We are looking at a third P&P machine for our factory. I have received brochures on a SMASUNG CP30V machine. It looks great and has all the plus points for a contract manufacturing company such as ourselves. The basic specs are: | 14400 cph - 3 he
Electronics Forum | Sat Sep 12 10:46:46 EDT 1998 | Dennis B
We're installing our first SMT line and my boss asked me a question I couldn't answer right off the top of my head. I have been an SMT process engineer for about 12 years and I guess this just never came up before. I was surprised but it made good se
Electronics Forum | Fri Sep 11 07:29:03 EDT 1998 | Wayne Bracy
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Mon Aug 31 22:30:09 EDT 1998 | Kelly Morris
We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. Our pad design is .020" diameter pads with .025" solder resist diameter. The center
Electronics Forum | Tue Sep 01 19:16:51 EDT 1998 | Kallol Chakraborty
| We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | Our pad design is .020" diameter pads with .025" solder resist diameter. The ce
